Advanced Micro Devices has released the first details concerning its forthcoming processors based on the new micro-architecture as well as supporting chipset and platform. Even though the new mobile technology is likely to offer promising performance and DirectX 10-compatible built-in graphics, it emerges on the market only in mid-2008.

“Through the combination of our recent processor and chipset launches and the ‘Better by Design’ program, AMD is constantly establishing new heights of competitiveness in serving the needs of our notebook customers. With the unveiling of the ‘Puma’ mobile platform we’re sending a clear signal to the market that we intend to drive continued innovation in notebook computing in 2008 and beyond,” said Chris Cloran, vice president, AMD Notebook Division.

Current mobile platform is based on AMD’s M690 core-logic and AMD Turion 64 X2 processors made using 65nm process technology and enables higher performance amid relatively low power consumption.

Puma mobile platform will be based on AMD’s code-named Griffin processor, AMD RS780 mobile chipset, which  supports PCI Express 2.0 bus, HyperTransport 3.0 bus, flash-cache for boosting hard drive performance and comes with built-in DirectX 10-compliant ATI Radeon graphics core that also features hardware-assisted decoding of high-definition content from Blu-ray and HD DVD discs. In addition, the new core sports DVI, D-sub and DisplayPort outputs.

AMD also said that code-named Griffin mobile microprocessors based on the company’s next-generation micro-architecture will include several new features designed to cut-down their power consumption:

• Power optimized HyperTransport™ and memory controllers integrated in the processor silicon that operate on a separate power plane as the processor cores, thereby enabling the cores to go into reduced power states;
• Dynamic performance scaling offers enhanced battery life with reduced power consumption through separate voltage planes enabling each core to operate at independent frequency and voltage;
• Power-optimized HyperTransport™ 3.0 with a more than tripling of peak I/O bandwidth, plus new power features including dynamic scaling of link widths.