IBM, Chartered Semiconductor Manufacturing,  Samsung Electronics and ARM have announced they will develop a comprehensive 32nm and 28nm systems-on-a-chip (SoCs) design platform based on high-k metal-gate (HKMG) technology from the IBM-led joint-development alliance. The design will be aimed at mobile gadgets and will compete directly with traditional processors for mobile apps as well as against Intel Atom.

Under this multi-year collaboration, ARM will develop and license a design platform of physical intellectual property (IP) including logic, memory and interface products for the Common Platform technology alliance of IBM, Chartered and Samsung for distribution to their customers. The Common Platform technology collaboration is aimed to accelerate the availability of leading-edge process technologies to foundry customers.

“Through this early engagement, we are creating the foundation for designing power efficient ARM SoCs for customers of the Common Platform. By utilizing the strength of our advanced microprocessors, our leadership in Physical IP design and advanced technology supported by the Common Platform, customers can accelerate the release of products for electronic devices that service a broad range of consumer applications,” said Warren East, chief executive of ARM .

ARM also announced its intent to develop customized physical IP targeted at achieving optimal power, performance, and area for their current and future Cortex processor family leveraging the unique attributes of the Common Platform HKMG 32nm/28nm technology. The HKMG technology breaks down the historical barrier of scaling, allowing significant power and performance advantage by utilizing new material science innovations. This technology targets a broad range of embedded segments, including mobile, portable and consumer electronics.

The early parallel development work between ARM and the Common Platform alliance leverages their respective expertise in processor IP, physical IP and technology development. This combination is projected to facilitate design scaling and accelerate the market availability of next generation mobile devices with unmatched performance, outstanding battery life and reduced cost.

The Common Platform partners expect to continue to expand the eco-system in this collaborative initiative to include more members in the near future. These additional partners will expand the offering of EDA support, services and IP offerings to enable customers to accelerate their time to market on these advanced technologies.

Tags: Chartered, IBM, Samsung, 28nm, 32nm