Sony Corp. has announced the commercialization of a chip that supports close proximity wireless transfer technology called TransferJet. The chip supports 350Mb/s transmission speed and is aimed at various mobile devices, such as smartphones and tablets. Sony demonstrated operation of the device at the ISSCC (International Solid-State Circuits Conference).
Sony CXD3271GW chip supports high-speed SDIO UHS-I as its host interface and introduces a new device driver design which provides a smooth and high-speed communications environment. These design enhancements have improved the new chip's transmission speed to over 350Mb/s, which is close to the theoretical maximum effective speed of 375Mb/s based on the TransferJet standard.
Furthermore, Sony's unique high-speed transmission technology and wideband RF-CMOS technology enables stable communications between devices, achieving the industry's highest receiving sensitivity of -82dBm (when receiving Rate65) which in fact exceeds the standard TransferJet value of -71dBm. Additionally, the RF balun, the RF switch for transmitter/receiver and the LDO and OTP-ROM, which used to be the externally embedded parts are now all pre-embedded into the new LSI, and a dedicated external crystal controlled oscillator will no longer be required by supporting a multi-reference clock. These factors contribute to a reduction in the number of parts implemented in the sets, a smaller footprint, and reductions in power consumption.
Sony will provide a software development kit for Android to facilitate the LSI's implementation in Android devices together with the software development kit for Linux which has been provided with the previous models to developers.
Sony said it will continue to actively promote the adoption of its TransferJet LSIs by manufacturers from fast-growing markets such as smartphones.