News
 

Bookmark and Share

(0) 

Qualcomm, the world’s largest supplier of application processors and wireless modems for mobile electronics, said that it had begun sampling one of the industry’s first global 4G/LTE category 4 modem that will bring improved networking speed to next-generation 4G/LTE smartphones and tablets.

“We recently sampled our third-generation multimode 3G/LTE chipset, the MDM9*25, which is also a global modem that adds support for LTE category 4 and carrier aggregation,” said Steven Mollenkopf, the president and chief executive officer of Qualcomm, during a conference call with financial analysts.

The new Qualcomm Gobi MDM9625/9225 global modem will be a unique offering that will support download transfer speeds up to 150.8Mb/s as well as upload transfer speeds up to 51Mb/s globally across different frequency bands. In addition to supporting both LTE Advanced (LTE Release 10) and HSPA+ Release 10 (including 84 Mbps dual carrier HSDPA), they are backward compatible with other standards including EV-DO Advanced, TD-SCDMA and GSM. The chipsets contain the industry's only modems to integrate 7 different radio access modes on a single baseband chip: cdma2000 (1X, DO), GSM/EDGE, UMTS (WCDMA, TD-SCDMA) and LTE (both LTE-FDD and LTE-TDD). This will allow OEMS to design mobile devices that can operate on the increasingly diverse set of radio network deployments and configurations used worldwide.The modems are made using 28nm process technology.

 

At present, Qualcomm supplies Gobi MDM9200 single mode and MDM9600 multi-mode 4G/LTE modems that category 3 wireless modems that support download transfer speeds up to 102Mb/s as well as upload transfer speeds up to 51Mb/s.

The new Qualcomm Gobi MDM9*25 chips will be used for high-end smartphones and tablets that will emerge next year.

 

Tags: Qualcomm, Gobi, 4G/LTE, 4G, LTE

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Wednesday, May 22, 2013

7:52 pm | Asrock’s A-Style Mainboards Set to Be Waterproof. Asrock’s New Intel 8-Series Mainboards to Feature Conformal Coating

7:35 pm | Nvidia Announces PhysX and APEX Support for Microsoft Xbox One. Microsoft Xbox One Games to Use PhysX and APEX

Tuesday, May 21, 2013

11:54 pm | Innodisk Rolls-Out Single-Chip 4GB – 64GB Solid-State Drives. Innodisk Releases World's First Industrial-Embedded SATA nanoSSD

11:33 pm | Intel’s New Chief Exec Begins to Shake Up the Company. Intel Wants to More Aggressively Address Emerging, Mobile Markets

10:25 pm | Seagate Reveals Industry's First Purpose-Built 4TB Video Hard Disk Drive. Seagate Develops Purpose-Built Hard Disk Drive for Video

10:03 pm | Microsoft Xbox One to Run Two Operating Systems at Once. To Provide the Best Experience, Xbox One Will Rely on Several Operating Systems

9:59 pm | Microsoft Xbox One Will Not Require “Always On” Connection, But Will Need the Internet for Nearly Everything. Microsoft Xbox One Will Need Internet Connection for Majority of Things

9:20 pm | Imec, GlobalFoundries and Qualcomm Team Up for High-Density STT-MRAM. Qualcomm Shows Interest in STT-MRAM, Collaboration with GlobalFoundries

8:58 pm | Intel Dominates Microprocessor Sales as AMD’s Shipments Drop Below Apple, Qualcomm and Samsung. Apple, Qualcomm and Samsung Pass AMD in Microprocessor Rankings

8:51 pm | Microsoft Xbox One Will Not Be Backwards Compatible with Xbox 360 Games. Microsoft Drops Backwards Compatibility for Xbox One

8:15 pm | Microsoft and Sony to Start Selling Next-Gen Consoles by End of October . Battlefield 4 Launch Date Reveals Availability Timeframe for PlayStation 4, Xbox One

7:44 pm | Microsoft Unveils Xbox One: The One and Only Machine One Needs in the Living Room. Microsoft Reveals Its New Vision for Game Consoles with Xbox One System