News
 

Bookmark and Share

(1) 

Intel Corp. on Monday revealed one of the world’s smallest and lowest-power multimode-multiband 4G/LTE solutions for global roaming in one SKU with envelope tracking and antenna tuning. Intel’s strategy is to deliver a leading low-power, global modem solution that works across multiple bands, modes, regions and devices.

The Intel XMM 7160 is one of the world’s smallest and lowest-power multimode-multiband 4G/LTE solutions (LTE / DC-HSPA+ / EDGE), supporting multiple devices including smartphones, tablets and ultrabooks.  The 7160 global modem supports 15 4G/LTE bands simultaneously, more than any other in-market solution. It also includes a highly configurable RF architecture running real time algorithms for envelope tracking and antenna tuning that enables cost-efficient multiband configurations, extended battery life, and global roaming in a single SKU.

“The 7160 is a well-timed and highly competitive 4G LTE solution that we expect will meet the growing needs of the emerging global 4G market. Independent analysts have shown our solution to be world class and I’m confident that our offerings will lead Intel into new multi-comm solutions. With LTE connections projected to double over the next 12 months to more than 120 million connections, we believe our solution will give developers and service providers a single competitive offering while delivering to consumers the best global 4G experience. Building on this, Intel will also accelerate the delivery of new advanced features to be timed with future advanced 4G network deployments,” said Hermann Eul, Intel vice president and co-general manager of the mobile and communications group.

Intel is currently shipping its single mode 4G/LTE data solution and will begin multimode shipments later in the first half of this year. The company is also optimizing its LTE solutions concurrently with its SoC roadmap to ensure the delivery of leading-edge low-power combined solutions to the marketplace.

Tags: Intel, Infineon, 4G/LTE, 4G, LTE

Discussion

Comments currently: 1
Discussion started: 02/27/13 06:41:33 PM
Latest comment: 02/27/13 06:41:33 PM

[1-1]

1. 
How it does compares to the Broadcom's BCM21892?
0 0 [Posted by: Nehemoth  | Date: 02/27/13 06:41:33 PM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015