AMD Plans to Start Shipping New Dual-Core Processors for Ultra-Thin Laptops This Quarter

AMD “Happy” with Congo Platform Design Wins

by Anton Shilov
04/23/2009 | 07:17 PM

Advanced Micro Devices said this week that it would start shipments of more advanced processors and core-logic sets aimed at cost-effective ultra-thin notebooks in late Q2 2009. The company also noted that it has design wins with its platform code-named Congo.

 

“We will start shipping Congo at the end of this quarter. […] We will have designs into which we will be shipping in the back half of this quarter,” said Robert Rivet, chief financial officer of Advanced Micro Devices, during a conference call with financial analysts.

AMD’s Congo platform is based on dual-core code-named Conesus dual-core central processing unit (AMD Athlon Neo X2) as well as AMD RS780M + SB710 core-logic set that features ATI Radeon HD DirectX 10-class graphics core as well as ATI Avivo HD hardware high-definition video post-processing engine.

Other details, such as clock-speeds of central processing units (CPUs), cache sizes, etc. are not known at the moment. It is even unknown whether the new processors will be made using 45nm or 65nm process technology. Earlier this year AMD said that power-consumption of the dual-core Athlon Neo X2 chips would not exceed that of single-core AMD Athlon Neo products, which means that it would stay in the range of 15W.

“Our upcoming Congo platform will extend the performance range affordable, ultra thin computing with the incorporation of dual-core CPUs and our 7-series chip sets. […] We are happy with the design win momentum that we have around Congo,” said Dirk Meyer, chief executive officer and president of AMD.