Intel Expects CULV Platform to Account for Significant Revenue Share

Intel Is Optimistic Regarding Ultra -Thin Notebooks, Expects Demand to Grow

by Anton Shilov
07/18/2009 | 10:50 PM

Intel Corp., the world’s largest maker of chips, said this week that it expects revenue portion from microprocessors and chipsets for consumer ultra low voltage (CULV) platform to increase significantly.

 

“Our recently introduced consumer ultra-low voltage mobile processors are helping to create a new PC segment of ultra-thin, full function notebooks. […] Ultra-thin notebooks are now shipping in the market and we believe they will further invigorate the notebook category and be a significant contributor to our profits in the future,” said Paul Otellini, chief executive officer and president of Intel.

Ultra-thin notebooks aimed at consumers is a completely new trend and many manufacturers still have not figured the exact demands of average users when it comes to ultra-portables.

Intel CULV platform is based on inexpensive Intel microprocessors and chipsets made using 45nm process technology. The chips are also available in small packages, which enables notebook makers to create small laptops.

“This product line takes advantage of two key technologies. First, our high-K metal gate transistors, which allow us to create the extremely low voltage variance of our processors, and, secondly, we have created advanced packaging breakthroughs that significantly reduce the overall footprint and thickness of notebooks based upon these products,” explained Mr. Otellini.

Intel’s CULV platform features processors and chipsets with reduced packaging area. Intel uses advanced packaging technologies for code-named Montevina small form-factor (SFF) chips, which reduced the package area of Intel Penryn SFF processor, Cantiga GS GMCH as well ICH9M SFF chips to 1415mm², down more than 50% from 3342mm², the package area of original Montevina.