Qualcomm Unveils First Front-End Global 4G/LTE Solution

Qualcomm Rolls-Out RF360 4G/LTE Solution

by Anton Shilov
02/21/2013 | 09:36 PM

Qualcomm on Thursday announced Qualcomm RF360 front end system-level solution, which addresses cellular radio frequency band fragmentation and enables for the first time a single, global 4G/LTE design for mobile devices. Band fragmentation is the biggest obstacle to designing today’s global LTE devices, with 40 cellular radio bands worldwide.

 

“The wide range of radio frequencies used to implement 2G, 3G and 4G/LTE networks globally presents an ongoing challenge for mobile device designers. Where 2G and 3G technologies each have been implemented on four to five different RF bands globally, the inclusion of 4G/LTE brings the total number of cellular bands to approximately 40,” said Alex Katouzian, senior vice president of product management, Qualcomm Technologies.

The Qualcomm RF front end solution comprises a family of chips designed to mitigate this problem while improving RF performance and helping OEMs more easily develop multiband, multimode mobile devices supporting all seven cellular modes, including LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM/EDGE. The RF front end solution includes the industry’s first envelope power tracker for 3G/4G LTE mobile devices, a dynamic antenna matching tuner, an integrated power amplifier-antenna switch, and an innovative 3D-RF packaging solution incorporating key front end components.

“Our new RF devices are tightly integrated and will allow us the flexibility and scalability to supply OEMs of all types, from those requiring only a region-specific LTE solution, to those needing LTE global roaming support,” said Mr. Katouzian.

The Qualcomm RF360 solution is designed to work seamlessly, reduce power consumption and improve radio performance while reducing the RF front end footprint inside of a smartphone by up to 50% compared to the current generation of devices. Additionally, the solution reduces design complexity and development costs, allowing OEM customers to develop new multiband, multimode LTE products faster and more efficiently. By combining the new RF front end chipsets with Qualcomm Snapdragon all-in-one mobile processors and Gobi 4G/LTE modems, Qualcomm Technologies can supply OEMs with a comprehensive, optimized, system-level 4G/LTE solution that is truly global.

As mobile broadband technologies evolve, OEMs need to support 2G, 3G, 4G/LTE and LTE Advanced technologies in the same device in order to provide the best possible data and voice experience to consumers no matter where they are.

The Qualcomm RF360 front end solution comprises of several key components and technologies:

OEM products featuring the complete Qualcomm RF360 solution are anticipated to be launched in the second half of 2013. 

Qualcomm also announced today a new RF transceiver chip, the WTR1625L. The chip is the first in the industry to support carrier aggregation with a significant expansion in the number of active RF bands. The WTR1625L can accommodate all cellular modes and 2G, 3G and 4G/LTE frequency bands and band combinations that are either deployed or in commercial planning globally. Additionally, it has an integrated, high-performance GPS core that also supports GLONASS and Beidou systems. The WTR1625L is tightly integrated in a wafer scale package and optimized for efficiency, offering 20% power savings compared to previous generations. The new transceiver, along with the Qualcomm RF360 front end chips, is integral to Qualcomm Technologies single-SKU world mode/LTE solution for mobile devices that are expected to launch in 2013.