News
 

Bookmark and Share

(0) 

Intel Corp. is developing a technology that will allow several displays to collaboratively display single image. Similar technologies are already used in commercial and professional markets, but Intel’s multi-client display linking is aimed at consumers and mobile devices.

Intel researchers are working on the technology to enable multiple mobile devices to dynamically work together to create a larger display as a part of Intel’s “Carry Small, Live Large” initiative. The displayed output from new and legacy applications will span the multiple devices creating a much richer visual experience. Intel offers an example of placing four mobile devices together while on the road to review the video of the day’s events.

The multi-client display linking technology is generally nothing new: similar methods are used to create large information displays out of smaller monitors in various facilities, such as airports. Additionally, many professional users utilize several monitors at once to display more information. The only difference of the technology in development compared to existing methods of linking several screens is wireless interconnection between the devices.

While it may be impressive to watch videos on several smartphones of mobile Internet devices (MIDs), in order to ensure flawless operation of multi-client display linking technology several similar devices will be needed. Considering the number of different models of handsets, notebooks, smartphones and other gadgets, it is virtually impossible that even two similar devices will be available in one room.

It is unknown when Intel's new technology reaches actual devices.

Tags: Intel

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015