News
 

Bookmark and Share

(1) 

Due to the global economic situation, USB WAN dongles outsell embedded WAN modems by the factor of three.

The global economic slowdown has had an impact on the future growth of embedded modem modules as customers have lengthened upgrade and replacement buying cycles. As a result, inexpensive USB wide area network (WAN) modems are currently much more popular than integrated WAN modems as more people want to upgrade existing devices to WAN support rather than get new systems.

According to ABI Research, embedded module shipments are not forecast to exceed USB modem shipments within the next five years, as USB “dongles” continue to go from strength to strength and average selling prices hold steady. Currently, USB configurations are outselling embedded modems by a ratio of more than three to one. By 2016, however, that ratio will be more like 1.2:1.

“Media tablets had a significant positive impact on embedded module shipments last year, with Apple coming out as the new leader for 3G modules. But embedded modules will likely falter this year as the tablet vendors look to drive prices down by foregoing add-ons including 3G/4G modems," said Jeff Orr, a senior practice director at ABI Research.

Tags: USB, WAN, 3G, 4G, HSDPA, 3.5G, LTE

Discussion

Comments currently: 1
Discussion started: 05/09/11 07:23:59 AM
Latest comment: 05/09/11 07:23:59 AM

[1-1]

1. 
That's only cause it's not a massive thing on notebooks and netbooks. I would rather have an integrated modem and have one of those for spare/back up. I hate going around with 5 or 6 USB devices i need to have plugged into my notebook (wich has 4 usb ports).

Cheers!
0 0 [Posted by: YukaKun  | Date: 05/09/11 07:23:59 AM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur

Sunday, August 24, 2014

6:12 pm | Former X-Bit Labs Editor Aims to Wed Tabletop Games with Mobile Platforms. Game Master Wants to Become a New World of Warcraft