News Archive

January, 2013
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Thursday, January 31, 2013

Nvidia Tesla-Accelerated Supercomputer Sets Record in Energy Efficiency. Nvidia  Intel  Tesla  Kepler  GK110  Xeon  Xeon Phi  Sandy Bridge-EP  Eurotech  Cineca  Eurora  Aurora Tigon
[1:50 pm]

Hybrid Supercomputer Sets New Energy Efficiency Milestone: 3150MFLOPS/W


Wednesday, January 30, 2013

Michael Dell to Retain Control over Company After Privatization. Dell  Silver Lake  Business  Microsoft
[1:42 pm]

Founder to Gain Influence on Dell As a Result of Privatization


Tuesday, January 29, 2013

Globalfoundries Expected to Apply for Permission to Build Fab 8 Module 2. Globalfoundries  Semiconductor  450mm  300mm  14nm  20nm  28nm  32nm  EUV
[1:46 pm]

Globalfoundries to Start Making Preparations for Assumed 450mm Fab Shortly

Microsoft Seeking Influence on Dell in Case of Investment - Report. Microsoft  Dell  Silver Lake  Business
[1:25 pm]

Microsoft Wants Dell to Use Windows After Becoming Private Company


Monday, January 28, 2013

Qualcomm and Imec to Continue Shaping Semiconductor Technology Roadmap. Qualcomm  Imec  Semiconductor
[1:05 pm]

Qualcomm and Imec to Sustain Collaboration on Process Technologies


Friday, January 25, 2013

Qualcomm Set to Develop Server ARM-Based System-on-Chips. Qualcomm  ARM  ARMv8  Cortex  AMD  Applied Micro  Cavium  Calxeda  Marvell  Nvidia  Samsung
[5:32 am]

Qualcomm Enters Race for Server-Grade ARM Chips

Intel: Final Decision Regarding Conversion of Fab 24 Has Not Been Made. Intel  Semiconductor  300mm  14nm
[4:09 am]

Ireland Okays New Intel Fab, But Intel’s Plans Not Finalized


Thursday, January 24, 2013

University Professor Develops Cheaper and Greener Way to Produce Silicon. Semiconductor
[1:59 pm]

New Silicon Production Method Could Slash Chip Prices


Wednesday, January 23, 2013

Apple Reports Record Shipments of iPad and iPhone amid Declines of Mac and iPod Sales. Apple  iPhone  iPad  iPod  Mac  Macintosh  iOS  Mac OS
[1:55 pm]

Apple Sets Another Sales Record with $54.5 Billion in Quarterly Revenue


Tuesday, January 22, 2013

Microsoft Discusses $3 Billion Investment into Dell. Microsoft  Dell  Silver Lake  Business
[1:50 pm]

Microsoft Could Invest $3 Billion into PC Maker Dell


Monday, January 21, 2013

TSMC: Demand for 20nm Chips Will Be Higher Than Demand for 28nm Chips Nowadays. TSMC  20nm  Semiconductor  300mm  28nm
[1:10 pm]

TSMC Foresees Rapid Ramp of 20nm Capacities in 2013 and 2014

Researchers Develop “Metamaterial” For All-Seeing Image Sensor.
[7:57 am]

Novel Sensor Provides Bigger Picture

Total Available Market for Micro-Servers to Reach $26.55 Billion in 2018 – Analysts. x86  ARM  AMD  SeaMicro  Intel  Hewlett-Packard  HP  Dell  Applied Micro  Calxeda  Fujitsu  Samsung  Marvell  Jaguar  Atom
[7:34 am]

Micro-Servers Expected to Become Major Business for Major Companies


Sunday, January 20, 2013

TSMC’s Sales of 28nm Chips in Fourth Quarter Totaled Nearly $1 Billion. TSMC  Semiconductor  28nm  40nm  65nm  55nm  80nm  90nm  130nm  150nm  Business
[11:30 pm]

28nm Chips Now Represent Nearly a Quarter of TSMC’s Wafer Revenue


Friday, January 18, 2013

Intel Demonstrates Industry’s First Fully Patterned 450mm Wafer: Photos. Intel  450mm  Semiconductor
[7:44 am]

Intel Shows Off First Fruit of Broad Industry 450mm Collaboration

Intel to Start Building First Dedicated 450mm Fab This Year. Intel  450mm  Semiconductor
[6:58 am]

Intel Reserves $2 Billion on Start of 450mm Fab Construction

Intel on Track to Start Making 14nm “Broadwell” Chips in 2013. Intel  14nm  300mm  Core  Broadwell  Semiconductor
[5:40 am]

Intel Begins Transition to 14nm Manufacturing Process This Year


Thursday, January 17, 2013

Preparations for Dell’s Buyout at Full Swing. Dell  Silver Lake  TPG  Business
[1:59 pm]

Silver Lake Attempts to Finalize Bidding Group for Dell

Moody’s Slams Hewlett-Packard for Underinvesting into R&D. HP  Hewlett-Packard  Business
[1:19 pm]

HP’s Revenue Growth May Slowdown Due to R&D Underinvestment – Moody’s


Wednesday, January 16, 2013

TSMC, GlobalFoundries and Samsung Lead Chip Foundry Rankings in 2012. TSMC  GlobalFoundries  Samsung  UMC  300mm  Semiconductor  IBM  SMIC
[11:56 am]

GlobalFoundries and Samsung Leave UMC Behind, TSMC Still Leads Contract Semiconductor Market

Intel Unleashes Rack Server Design with Silicon Photonics Interconnections. Intel  Facebook  Xeon  Atom
[6:27 am]

Intel and Facebook Collaborate on Disaggregated Rack-Scale Server Architecture


Tuesday, January 15, 2013

Ex-Apple CEO: Apple Must Take Advantage of Emerging Markets’ Growth. Apple  iPad  iPhone  iPod  Macintosh  Mac  MacBook  MacBook Air  MacBook Pro  Business
[1:58 pm]

John Sculley Thinks Apple Needs to Address Emerging Markets with Low-Cost Gadgets

GlobalFoundries Touts $10 Billion Fab 8 Module 2. GlobalFoundries  Semiconductor  300mm  450mm  14nm  20nm  28nm  32nm  EUV
[1:56 pm]

GlobalFoundries Looks Forward Second Module of Fab 8

Lenovo to Split into Two Global Products Groups – Report. Lenovo  ThinkPad  IdeaPad  Business
[1:54 pm]

Lenovo to Divide into Think Business Group and Lenovo Business Group


Monday, January 14, 2013

Dell Reportedly Interested in Going Private. Dell  Business  TPG  Silver Lake
[12:35 pm]

Dell Wants to Become Private Company


Wednesday, January 9, 2013

Sales of Microsoft Windows 8 Hit 60 Million Licenses. Microsoft  Windows  Business  Windows 8  Windows RT
[1:57 pm]

Dynamics of Windows 8 Adoption Slowdowns


Tuesday, January 8, 2013

Corning Launches New Gorilla Glass 3 with Native Damage Resistance. Corning  Gorilla Glass
[7:07 pm]

Corning Gorilla Glass 3 Better Withstands Hits and Scratches

GlobalFoundries to Build $2 Billion R&D Facility in New York. GlobalFoundries  Semiconductor  14nm  20nm  28nm  32nm  300mm  EUV  450mm
[1:11 pm]

GlobalFoundries to Establish Massive R&D Center Near Fab 8


Monday, January 7, 2013

New Version of SuperSpeed USB to Support 10Gb/s Data Rate. USB  Intel  Microsoft  HP  Hewlett-Packard
[1:20 am]

USB 3.0 to Gain 10Gb/s Speed, Set to Compete Against Thunderbolt


Thursday, January 3, 2013

TSMC to Start Trial Chip Production for Apple in Q1 2013 – Report. apple  samsung  tsmc  semiconductor  arm  cortex  28nm  32nm  powervr
[10:26 am]

TSMC to Make Apple A6X Chip Using 28nm Process Tech This Quarter

Corning to Showcase Gorilla Glass 3, Thunderbolt Cables at CES. Corning  Gorilla  Thunderbolt
[9:57 am]

Corning Gorilla Glass 3 to Be Tougher, More Scratch Resistant


Wednesday, January 2, 2013

AMD Appoints Long-Time Veteran to Chief Financial Officer Position. AMd  Business
[12:18 pm]

Devinder Kumar Becomes AMD’s CFO

Hewlett-Packard Still Considers Getting Rid of Units Not Meeting Business Targets. HP  Hewlett-Packard  Business
[10:05 am]

HP May Dispose Business Units That Fail to Meet Targets


Tuesday, January 1, 2013

Chief Exec of Imagination Knighted for Services to Technology and Innovation. Imagination  Imagination Technologies  PowerVR
[1:54 pm]

Hossein Yassaie Awarded a Knighthood by the Queen