Bookmark and Share


HyperTransport Technology Consortium, an industrial organization that develops chip-to-chip interconnection technologies, today unveiled new specifications for the second version of the HyperTransport technology that is successfully deployed in numerous applications.

The HyperTransport Release 2.0 Specification introduces three more powerful bus speeds and maps to PCI Express, the successor of PCI for the next decade. HyperTransport’s speed capability extends from current 1.6Gb/s per pin to 2.0Gb/s, 2.4Gb/s, and 2.8Gb/s per pin using dual-data rate clocks at 1.0GHz, 1.2GHz, and 1.4GHz, delivering a maximum aggregate bandwidth of 22.40GB/s from current 12.8GB/s in both directions.

“Release 2.0’s substantial speed and bandwidth extensions combined with PCI Express bus extensibility reaffirm and consolidate HyperTransport’s long term chip-to-chip I/O technology leadership while preserving HyperTransport’s low implementation cost and the multi-million dollars investments made by the HyperTransport Consortium members and their considerable customer base,” a spokesperson for the HyperTransport Technology Consortium said.

The electrical protocols supporting the new clock rates are backward compatible with all previous versions of the HyperTransport electrical specifications. Moreover, parts compatible with PCI Express will also be compatible with the new HyperTransport 2.0.

HyperTransport technology was developed by a group of companies headed by CPU maker Advanced Micro Devices. No surprise that AMD is actually one of the most interested companies in development of the transfer protocol. Reportedly, AMD will introduce its new Athlon 64 processors with 1GHz HyperTransport bus in the late first quarter of the year.


Comments currently: 0

Add your Comment

Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015