News
 

Bookmark and Share

(0) 

HyperTransport Technology Consortium, an industrial organization that develops chip-to-chip interconnection technologies, today unveiled new specifications for the second version of the HyperTransport technology that is successfully deployed in numerous applications.

The HyperTransport Release 2.0 Specification introduces three more powerful bus speeds and maps to PCI Express, the successor of PCI for the next decade. HyperTransport’s speed capability extends from current 1.6Gb/s per pin to 2.0Gb/s, 2.4Gb/s, and 2.8Gb/s per pin using dual-data rate clocks at 1.0GHz, 1.2GHz, and 1.4GHz, delivering a maximum aggregate bandwidth of 22.40GB/s from current 12.8GB/s in both directions.

“Release 2.0’s substantial speed and bandwidth extensions combined with PCI Express bus extensibility reaffirm and consolidate HyperTransport’s long term chip-to-chip I/O technology leadership while preserving HyperTransport’s low implementation cost and the multi-million dollars investments made by the HyperTransport Consortium members and their considerable customer base,” a spokesperson for the HyperTransport Technology Consortium said.

The electrical protocols supporting the new clock rates are backward compatible with all previous versions of the HyperTransport electrical specifications. Moreover, parts compatible with PCI Express will also be compatible with the new HyperTransport 2.0.

HyperTransport technology was developed by a group of companies headed by CPU maker Advanced Micro Devices. No surprise that AMD is actually one of the most interested companies in development of the transfer protocol. Reportedly, AMD will introduce its new Athlon 64 processors with 1GHz HyperTransport bus in the late first quarter of the year.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur

Sunday, August 24, 2014

6:12 pm | Former X-Bit Labs Editor Aims to Wed Tabletop Games with Mobile Platforms. Game Master Wants to Become a New World of Warcraft