Chartered Semiconductor, a contract maker of chips from Singapore, announced extension of its technology agreement with IBM, under which the companies will develop 32nm bulk complementary metal oxide semiconductor (CMOS) process technology that the firms will be able to use on their own semiconductor foundries.

The extension to 32nm builds on the multi-year agreement that the two companies first signed in November 2002. The joint collaboration has enabled Chartered to accelerate its technology roadmap for leading-edge manufacturing solutions, spanning four major generations of advanced process technology, including 90nm, 65nm, 45nm and 32nm logic processes.

“Today’s announcement demonstrates IBM and Chartered’s commitment to next-generation technology, and promises to extend our track record of success in developing solutions for our customers,” said Lisa Su, vice president, semiconductor research and development center, IBM. “The combination of Chartered’s manufacturing horsepower and IBM’s innovation roadmap positions us well for continued leadership in the future.”

A little less than a year ago IBM, Sony and Toshiba also signed a technology agreement to jointly develop 32nm fabrication process, whereas AMD and IBM have been collaborating on the 32nm and 22nm process technologies’ research for over a year now. It is not clear whether 32nm fabrication processes co-developed with IBM will be similar.

As with previous nodes, 32nm development activities will be conducted at 300mm semiconductor fabrication facility in East Fishkill, New York. Each company will have the ability to implement the jointly developed processes in its own manufacturing facilities.