News
 

Bookmark and Share

(0) 

Even though Taiwan Semiconductor Manufacturing Co. recently signed a pact with Intel Corp. and Samsung Electronics regarding standardization of tools that are used in wafer manufacturing, the contract maker of semiconductors has no concrete plans to build a fab that operates 450mm wafers.

“TSMC has no timetable or concrete plans to build a 450mm fab. […] The wafer fab facilities currently under construction at site on the intersection of Park Avenue 3 and Park Avenue 5 of the Hsinchu Science Park are phases 4 and 5 of TSMC Fab 12. These are 300mm wafer facilities and will serve as the company’s research and  development centers and initial production site for advanced technologies,” the world’s top contract makers of semiconductors said in a statement with Taiwan Stock Exchange.

Earlier this week Intel Corp., Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced that they had reached an agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.

TSMC further explained that the press release issued by Intel, Samsung, and TSMC does not mean a three-way alliance.

The talks regarding transition to 450mm wafers have been online since 2004, if not earlier; however, there are numerous manufacturers of chips who claim that 450mm wafers are not needed in 2012. For example, Advanced Micro Devices claims that improving 300mm facilities can provide a lot of benefits without tremendous investments into the new format of wafer manufacturing.

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, April 14, 2014

8:23 am | Microsoft Vows to Release Xbox 360 Emulator for Xbox One. Microsoft Xbox One May Gain Compatibility with Xbox 360 Games

Tuesday, April 1, 2014

10:39 am | Microsoft Reveals Kinect for Windows v2 Hardware. Launch of New Kinect for Windows Approaches

Tuesday, March 25, 2014

1:57 pm | Facebook to Acquire Virtual Reality Pioneer, Oculus VR. Facebook Considers Virtual Reality as Next-Gen Social Platform

1:35 pm | Intel Acquires Maker of Wearable Computing Devices. Basis Science Becomes Fully-Owned Subsidiary of Intel

Monday, March 24, 2014

10:53 pm | Global UHD TV Shipments Total 1.6 Million Units in 2013 – Analysts. China Ahead of the Whole World with 4K TV Adoption

10:40 pm | Crytek to Adopt AMD Mantle Mantle API for CryEngine. Leading Game Developer Adopts AMD Mantle

9:08 pm | Microsoft Unleashes DirectX 12: One API for PCs, Mobile Gadgets and Xbox One. Microsoft Promises Increased Performance, New Features with DirectX 12

3:33 pm | PowerVR Wizard: Imagination Reveals World’s First Ray-Tracing GPU IP for Mobile Devices. Imagination Technologies Brings Ray-Tracing, Hybrid Rendering Modes to Smartphones and Tablets

2:00 pm | Nokia Now Expects to Close Deal with Microsoft in Q2. Sale of Nokia’s Division to Close Next Month