News
 

Bookmark and Share

(0) 

IBM has unveiled the semiconductor industry’s first computationally based process for production of next generation 22nm semiconductors. Known as Computational Scaling (CS), the process enables the production of semiconductors at 22nm and beyond. The new initiative will feature support from several of IBM’s key partners initially including Mentor Graphics and Toppan Printing.

These days the leading-edge semiconducturs are manufactured at 45nm or larger technology nodes. Producing circuits at 22nm is a challenging milestone since current lithography methods – the process of designing photomasks to image circuit patterns on silicon wafers in mass quantity – are not adequate for critical layers at 22nm due to fundamental physical limitations. IBM’s computational scaling overcomes these limitations by using mathematical techniques to modify the shape of the masks and characteristics of the illuminating source at each layer of an integrated circuit.

“The traditional scaling approach is optical-resolution centric. IBM's computational scaling approach is centered on advanced mathematical techniques encapsulated in software tools that use high performance computing systems. This technique also makes technology complexity transparent to the designer and maximizes flexibility through integrated flows and automation,” said Gary Patton, vice president of IBM semiconductor research and development center.

IBM's CS solution is an ecosystem that includes such componene a new resolution enhancement technique (RET) that uses source-mask optimization (SMO); virtual silicon processing with TCAD; predictive process modeling; design-rule generation and corresponding models; design tooling; design enablement; complex illumination; variance control; and mask fabrication, along with necessary partnerships.

The individual components of IBM’s CS solution include source mask optimization technology, virtual fabricator software, design technology co-optimization process, design enablement tools, critical dimension variance control adaptive control system, as well as photomasks with the required feature sizes.

Tags: IBM, 22nm, Semiconductor

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, April 14, 2014

8:23 am | Microsoft Vows to Release Xbox 360 Emulator for Xbox One. Microsoft Xbox One May Gain Compatibility with Xbox 360 Games

Tuesday, April 1, 2014

10:39 am | Microsoft Reveals Kinect for Windows v2 Hardware. Launch of New Kinect for Windows Approaches

Tuesday, March 25, 2014

1:57 pm | Facebook to Acquire Virtual Reality Pioneer, Oculus VR. Facebook Considers Virtual Reality as Next-Gen Social Platform

1:35 pm | Intel Acquires Maker of Wearable Computing Devices. Basis Science Becomes Fully-Owned Subsidiary of Intel

Monday, March 24, 2014

10:53 pm | Global UHD TV Shipments Total 1.6 Million Units in 2013 – Analysts. China Ahead of the Whole World with 4K TV Adoption

10:40 pm | Crytek to Adopt AMD Mantle Mantle API for CryEngine. Leading Game Developer Adopts AMD Mantle

9:08 pm | Microsoft Unleashes DirectX 12: One API for PCs, Mobile Gadgets and Xbox One. Microsoft Promises Increased Performance, New Features with DirectX 12

3:33 pm | PowerVR Wizard: Imagination Reveals World’s First Ray-Tracing GPU IP for Mobile Devices. Imagination Technologies Brings Ray-Tracing, Hybrid Rendering Modes to Smartphones and Tablets

2:00 pm | Nokia Now Expects to Close Deal with Microsoft in Q2. Sale of Nokia’s Division to Close Next Month