The USB 3.0 Promoter Group today announced the completion of the USB 3.0 specification, the technical map for device manufacturers to deliver SuperSpeed USB technology to the market.

“SuperSpeed USB is the next advancement in ubiquitous technology. Today’s consumers are using rich media and large digital files that need to be easily and quickly transferred from PCs to devices and vice versa. SuperSpeed USB meets the needs of everyone from the tech-savvy executive to the average home user,” said Jeff Ravencraft, USB-IF president and chairman.

SuperSpeed USB brings significant power and performance enhancements to the popular USB standard while offering backward compatibility with billions of USB-enabled PCs and peripheral devices currently in use by consumers. Delivering data transfer rates up to ten times faster than Hi-Speed USB (USB 2.0), or at 4.8Gb/s, meaning that a file as large as 600MB could be transferred in just a second in the best case scenario, with optimized power efficiency, SuperSpeed USB is the next step in the continued evolution of USB technology.

The USB 3.0 Promoter Group, comprised of Hewlett-Packard, Intel Corp., Microsoft Corp., NEC Corp., ST-NXP Wireless and Texas Instruments, developed the USB 3.0 specification. The group now has transitioned the specification’s management to the USB Implementers Forum (USB-IF), the managing body of USB specifications. The USB 3.0 Promoter Group is now accepting adopters of the USB 3.0 specification, which has been finalized at the 1.0 level.

It is anticipated that initial SuperSpeed USB discrete controllers will appear in the second half of 2009 and consumer products will appear in 2010, with adoption continuing throughout 2010. The first SuperSpeed USB devices will likely include data-storage devices such as flash drives, external hard drives, digital music players and digital cameras.

Tags: USB, Intel