News
 

Bookmark and Share

(0) 

United Microelectronics Corp., a leading semiconductor foundry, on Wednesday announced a significant milestone for its high-k/metal-gate (HKMG) technology with validation of the process through 45nm SRAM product yield. The technology will be used for UMC's next generation 32/28nm process, which will be available in 2010.

“UMC is making steady progress in bringing our HKMG process towards 32/28nm pilot production so that our customers can benefit from the performance advantages of this technology. Despite the global economic uncertainties, UMC continues to move full speed ahead with our advanced technology R&D efforts. With our recent achievement of working 28nm SRAM, coupled with this latest HKMG process material validation, we are well positioned to offer customers a strong technology platform solution when our 32/28nm technology becomes available in 2010,” said Mr. S.C. Chien, vice president of advanced technology development at UMC.

In October 2008, UMC produced the foundry industry's first 28nm SRAM chips based on its low-leakage (LL) process, which utilized advanced double-patterning immersion lithography and strained silicon technology.

UMC's dual approach for its 32/28nm technology addresses different market applications. The foundry uses conventional silicon gate/silicon-oxy-nitride gate oxide technology for its LL process, which is ideal for portable applications such as mobile phone ICs, while the HKMG stack is primarily aimed at speed-intensive products such as graphic, application processor, and high-speed communication ICs.

In fact, according to the company, the HKMG option can also be customized for 32/28nm low power applications to address individual customer requirements.

Earlier this year UMC’s arch-rival Taiwan Semiconductor Manufacturing Co. said that it would only use HKMG technology for its 28nm fabrication process due in 2010. Since 32nm process technology is likely to become available earlier than the 28nm tech, UMC may get the advantage over TSMC since the latter’s 32nm process does not feature high-k metal gate.

Tags: UMC, 32nm, 28nm, Semiconductors, TSMC

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur

Sunday, August 24, 2014

6:12 pm | Former X-Bit Labs Editor Aims to Wed Tabletop Games with Mobile Platforms. Game Master Wants to Become a New World of Warcraft