News
 

Bookmark and Share

(0) 

Intel Corp. said that it had completed the development phase of its next-generation manufacturing process that further shrinks chip circuitry to 32nm. The company reiterated that it was on track for production readiness of this future generation using even more energy-efficient, denser and higher performing transistors in the fourth quarter of 2009.

"Our manufacturing prowess and resulting products have helped us widen our lead in computing performance and battery life for Intel-based laptops, servers and desktops. As we've shown this year, the manufacturing strategy and execution have also given us the ability to create entirely new product lines for MIDs, CE equipment, embedded computers and netbooks , " said Mark Bohr, Intel Senior Fellow and director of process architecture and integration.

Intel will provide a multitude of technical details around the 32nm process technology along with several other topics during presentations at the International Electron Devices meeting (IEDM) next week in San Francisco, California.

Intel’s 32nm manufacturing process utilizes the company’s second-generation, high-k/metal gate technology, a strained channel, and nine levels of low-k interconnect dielectrics, according to previously released information that cites an Intel’s document available from IEDM’s web-site on request. The process enables the highest drive currents reported to date for 32nm technology: NMOS saturated drive current is 1.55mA/micron while the corresponding PMOS value is 1.21mA/micron.

Intel’s 32nm test chips incorporate logic and memory (static random access memory, SRAM) to house more than 1.9 billion transistors with 4.2Mb² array density. The chip features 0.171 micron² cell size. The process evaluation chip reportedly functioned at 3.80GHz with 1.1V voltage.

Tags: Intel, 32nm, Semiconductors

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, April 14, 2014

8:23 am | Microsoft Vows to Release Xbox 360 Emulator for Xbox One. Microsoft Xbox One May Gain Compatibility with Xbox 360 Games

Tuesday, April 1, 2014

10:39 am | Microsoft Reveals Kinect for Windows v2 Hardware. Launch of New Kinect for Windows Approaches

Tuesday, March 25, 2014

1:57 pm | Facebook to Acquire Virtual Reality Pioneer, Oculus VR. Facebook Considers Virtual Reality as Next-Gen Social Platform

1:35 pm | Intel Acquires Maker of Wearable Computing Devices. Basis Science Becomes Fully-Owned Subsidiary of Intel

Monday, March 24, 2014

10:53 pm | Global UHD TV Shipments Total 1.6 Million Units in 2013 – Analysts. China Ahead of the Whole World with 4K TV Adoption

10:40 pm | Crytek to Adopt AMD Mantle Mantle API for CryEngine. Leading Game Developer Adopts AMD Mantle

9:08 pm | Microsoft Unleashes DirectX 12: One API for PCs, Mobile Gadgets and Xbox One. Microsoft Promises Increased Performance, New Features with DirectX 12

3:33 pm | PowerVR Wizard: Imagination Reveals World’s First Ray-Tracing GPU IP for Mobile Devices. Imagination Technologies Brings Ray-Tracing, Hybrid Rendering Modes to Smartphones and Tablets

2:00 pm | Nokia Now Expects to Close Deal with Microsoft in Q2. Sale of Nokia’s Division to Close Next Month