News
 

Bookmark and Share

(0) 

Globalfoundries, a joint-venture between Advanced Micro Devices and Advanced Technology Investment Company, said on Wednesday that STMicroelectronics, a leading supplier of various chip solutions, plans to manufacture its new low-power chips using 40nm bulk low-power fabrication process at Globalfoundries.

The two companies indicated that the 40nm LP process is ideal for the next generation of wireless applications, handheld devices, and consumer electronics, which require both excellent performance and long battery life.  First tape out and production of ST products by Globalfoundries is planned to start in 2010.

“To ensure ample capacity for our customer/partners at the leading-edge of low-power design, ST needs an agile and high-performance manufacturing partner that can adapt to our changing needs. With a strong commitment to manufacturing and technology excellence at the leading-edge, we believe Globalfoundries is an excellent partner to collaborate on low-power design innovation in 2010 and beyond,” said Jean-Marc Chery, executive vice president and chief technology officer at STMicroelectronics.

Earlier it was expected that this week Globalfoundries will sign in ATI, graphics business unit of AMD, and Nvidia Corp. as clients. In fact, as a part of the agreement between AMD and Globalfoundries, ATI is obliged to make certain part of its graphics chips at Globalfoundries, but no details have been revealed so far.

 

Tags: Globalfoundries, STMicroelectronics, AMD, ATI, Nvidia, Semiconductor

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Wednesday, October 8, 2014

8:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

12:22 pm | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

9:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

6:41 pm | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture

Monday, August 25, 2014

6:05 pm | Chinese Inspur to Sell Mission-Critical Servers with AMD Software, Power 8 Processors. IBM to Enter Chinese Big Data Market with the Help from Inspur