We could now rather expect that they starting test production on their 32nm process before jumping on new bandwagon with highk on 28nm as they claimed few month before.
Morris Chang, the chairman of Taiwan Semiconductor Manufacturing Company, said during a conference in Taipei, Taiwan, said that yield rate of the company’s 40nm manufacturing process is now considerably higher than it was earlier this year. This is a good news for TSMC’s customers who can now deliver their products in higher volumes.
According to the chairman, at present yield rate on the company’s flagship 40nm node is 60% (which means that 60% of chips on a single wafer are fully operational), up considerably from 30% earlier this year. The foundry expects to process around 30 thousand wafers on 40nm in the third quarter, Mr. Chang is reported to have said by DigiTimes web-site.
TSMC also indicated that shipments of 40nm/45nmwafers tripled those of Q1 and surpassed 1% of total wafer sales. Meanwhile, the lion’s share of TSMC’s wafer revenues (35%) comes from wafers made using 150nm or even more mature processes, 110nm/130nm account for 13%, 90nm process technology accounted for 23% of wafer revenues and 65nm/55nm accounted for 28%.
TSMC this week announced consolidated revenue of NT$74.21 billion ($2.263 billion), net income of NT$24.44 billion ($745 million), and diluted earnings per share of NT$0.94 ($0.14 per ADS unit) for the second quarter ended June 30, 2009.
Year-over-year, second quarter revenue decreased 15.8% while net income and diluted EPS decreased 15% and 13.9%, respectively. Compared to first quarter of 2009, second quarter results represent an 87.9% increase in revenue, and an increase of 1467.9% in net income and an increase of 1466.5% in diluted EPS. All figures were prepared in accordance with R.O.C. GAAP on a consolidated basis. Gross margin for the quarter was 46.2%, operating margin was 33.9%, and net margin was 32.9%.