News
 

Bookmark and Share

(0) 

Taiwan Semiconductor Manufacturing Company and United Microelectronics Corp., two leading contract makers of semiconductors, are ramping up their 300mm manufacturing capacities in order to better serve their customers and also improve their competitive positions against Globalfoundries, a new player on the contract semiconductor market, and each other.

TSMC plans to boost output of fab 14 located in southern Taiwan at the Tainan Science Park to 6 thousand wafers by the end of 2009, and to about 35 thousand wafers in 2010, according to a BNP Paribas report cited by DigiTimes web-site. Fab 14 processes 300mm wafers at 40nm manufacturing process. It is believed that the output is increased in order to fulfill demand for Intel Atom-based system-on-chips products. 

In total, TSMC now produces about 140 thousand 300mm wafers per month. Foreign institutional investors estimated the company to spend $3 billion on expansion in 2010, when its output of 300mm wafers may top 200 thousand units a month, reports Taiwan Economic News.

UMC also intends to ramp up capacity of its fab 12B to 100 thousand 300mm wafers per month, up from roughly 50 thousand today.

Globalfoundries, a joint venture between Advanced Micro Devices and Advanced Technology Investment Company, is considerably behind even today’s UMC in terms of 300mm output. However, the company will merge with Chartered Semiconductor Manufacturing, which will be acquired by ATIC, which will improve its output and increase the amount of customers.

Tags: TSMC, UMC, Globalfoundries, Semiconductor, Business, 300mm, 40nm

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, April 14, 2014

8:23 am | Microsoft Vows to Release Xbox 360 Emulator for Xbox One. Microsoft Xbox One May Gain Compatibility with Xbox 360 Games

Tuesday, April 1, 2014

10:39 am | Microsoft Reveals Kinect for Windows v2 Hardware. Launch of New Kinect for Windows Approaches

Tuesday, March 25, 2014

1:57 pm | Facebook to Acquire Virtual Reality Pioneer, Oculus VR. Facebook Considers Virtual Reality as Next-Gen Social Platform

1:35 pm | Intel Acquires Maker of Wearable Computing Devices. Basis Science Becomes Fully-Owned Subsidiary of Intel

Monday, March 24, 2014

10:53 pm | Global UHD TV Shipments Total 1.6 Million Units in 2013 – Analysts. China Ahead of the Whole World with 4K TV Adoption

10:40 pm | Crytek to Adopt AMD Mantle Mantle API for CryEngine. Leading Game Developer Adopts AMD Mantle

9:08 pm | Microsoft Unleashes DirectX 12: One API for PCs, Mobile Gadgets and Xbox One. Microsoft Promises Increased Performance, New Features with DirectX 12

3:33 pm | PowerVR Wizard: Imagination Reveals World’s First Ray-Tracing GPU IP for Mobile Devices. Imagination Technologies Brings Ray-Tracing, Hybrid Rendering Modes to Smartphones and Tablets

2:00 pm | Nokia Now Expects to Close Deal with Microsoft in Q2. Sale of Nokia’s Division to Close Next Month