Even though Intel Corp. has shed a lot of light onto USB 3.0 at the last month’s Intel Developer Forum, the world’s largest chipmaker does not seem to be trying to speed-up introduction of its chipsets that support the new interconnection standard. Since Intel commands the lion’s share of the chipset market, any delay at Intel means postponement for the whole ecosystem.
Back at IDF 2009 it was unofficially revealed that Intel planned to start sampling of core-logic sets with SuperSpeed USB support early in 2010, however, a report by EETimes web-site citing “a senior technology manager at a top tier PC maker” said that Intel had shifted “its plans out a year”. As a result, it is hardly possible that USB 3.0 will be available from Intel next year, which means that mainboard makers will have to install separate USB 3.0 controllers onto their platforms, something that adds cost.
“It is hard to commit to an emerging technology like this when the key silicon enablers are not making it a priority. You get into a chicken-and-egg situation,” the source is reported to have said.
Obviously, with no support from Intel, USB 3.0 will not be able to quickly conquer a significant part of the market, which means that makers of digital cameras, flash drivers and others will only enable USB 3.0 on higher-end devices. On the other hand, is very unlikely that large makers would enable USB 3.0 on inexpensive produces even if the interconnection is to be supported by Intel’s logic.
Intel officials said that there was no delay of USB 3.0, however, provided not actual introduction timeframes.