News
 

Bookmark and Share

(0) 

Globalfoundries, the world’s third largest maker of semiconductors that is controlled by Advanced Technology Investment Company and Advanced Micro Devices, announced that it would produce chips for Qualcomm, a leading vendor of communication semiconductors.

Initially, Globalfoundries intends to provide Qualcomm with access to leading-edge 45nm low power (LP) and 28nm (LP) technologies with an intended collaboration on future advanced process nodes.  The intended relationship with Globalfoundries will focus on Qualcomm’s wireless businesses and provide technologies for handheld products that operate on the CDMA2000, WCDMA and 4G/LTE cellular standards, including the emerging smartbook device segment.  Both companies anticipate that Globalfoundries will begin accepting Qualcomm designs at Fab 1 in Dresden in 2010.

“By bringing the benefits of a leading-edge IDM model to the foundry world, we provide customers with the fastest option to get advanced products to market in volume and at mature yield. We’re pleased to have an opportunity to collaborate with a market leader like Qualcomm as they enable new classes of wireless products and technologies for the future,” said Douglas Grose, chief executive officer of Globalfoundries.

 Qualcomm’s Integrated Fabless Manufacturing (IFM) model builds tight technical interfaces among all parties in the semiconductor development cycle, delivering greater efficiency, lower costs and quicker time to market for new products. A crucial component of the Qualcomm’s IFM strategy is a multi-foundry approach, which helps assure product supply to Qualcomm’s device manufacturing customers and provides the Company flexibility to meet rapidly changing demands. The IFM model is designed to accelerate Qualcomm’s technology execution and to meet the exponential growth expected in the wireless semiconductor market.

Tags: Globalfoundries, Qualcomm, Semiconductor, AMD, ATIC

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Friday, May 24, 2013

6:09 pm | Second-Generation Kinect Sensor for Windows Due in 2014 – Microsoft. Microsoft Discloses Additional Details About Kinect 2

4:24 pm | New Technique May Open Up an Era of Atomic-Scale Semiconductor Devices. Atom-Scale Semiconductor Devices May Be Incoming, Thanks to New Researchers

Thursday, May 23, 2013

11:30 pm | Kinect Support Is Not Mandatory for Xbox One Video Games – Microsoft. Microsoft Will Not Require Compulsory Support of Kinect from Xbox One Games

11:20 pm | Thermaltake Publishes List of PSUs Compatible with Intel Cori i “Haswell” Chips. 20 PSUs from Thermaltake Are Compatible with Next-Gen Intel Chips

11:10 pm | European Amazon Stores Start to List Xbox One with €599 Price-Tag. Microsoft Xbox One May Cost €599 in Europe, If First Listings Are Correct

9:28 pm | Apple to Assemble Macs in Texas, Set to Manufacture Parts Across the U.S. Apple’s Plan to Move Production Back to U.S. Gets Shape

9:12 pm | Microsoft Confident in Lack of Quality Issues with Xbox One Hardware. Microsoft Vows Xbox One Will Not Have RROD-Like Issues

8:52 pm | AMD Officially Launches New-Generation APUs for Mobile Applications [UPDATED]. AMD Introduces Kabini, Temash and Richland Accelerated Processing Units

6:51 pm | OCZ Reveals Vertex 450 Solid-State Drives: High-End Performance at Mainstream Prices. OCZ Introduces New SSDs Based on Indilinx Barefoot 3 Controller

3:40 pm | Nvidia Unveils GeForce GTX 780: GK110-Based Consumer Solution for $649. Nvidia’s Cut Down Titan LE Becomes GeForce GTX 780