News
 

Bookmark and Share

(1) 

Asmedia Technology, a chip design subsidiary of Asustek Computer, plans to grab a significant portion of the USB 3.0 controller market by selling its SuperSpeed USB chip at half the price of that from NEC Electronics.

Asmedia Technology intends to start mass production of its USB 3.0 controller by the end of June 2010, reports DigiTimes web-site. The chip is claimed to cost below $3 per unit in mass quantities, whereas NEC Electronics currently costs around $6. The goal of Asmedia is claimed to be shipment of ten million SuperSpeed USB chips.

According to the media report, Asustek Computer, the world’s largest maker of mainboards, has already transferred all its USB 3.0 controller orders to Asmedia, whereas MicroStar International (MSI), Gigabyte Technology and Elitegroup Computer Systems (ECS) are expected to shift their USB 3.0 chip orders later.

Via Technology, another designer of USB 3.0 controllers, has also submitted its chip orders for evaluation by motherboard manufacturers.

Starting from April, 2010, NEC Electronics increased monthly production of its SuperSpeed USB (USB 3.0) host controller (part number µPD720200) to two million units, hence, by the end of the year the company will be able to ship 21 million units of its USB 3.0 chips.

Tags: Asmedia, ASUS, USB, MSI, Gigabyte, ECS

Discussion

Comments currently: 1
Discussion started: 04/22/10 05:38:02 PM
Latest comment: 04/22/10 05:38:02 PM

[1-1]

1. 
Go VIA! Don't die!
0 0 [Posted by: East17  | Date: 04/22/10 05:38:02 PM]
Reply

[1-1]

Add your Comment




Latest News

Friday, May 17, 2013

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS