IBM, Globalfoundries, Samsung and STM announced plans to four companies to collaborate to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance.
The synchronization process helps ensure that customers’ chip designs can be produced at multiple sources in three different continents with no redesign required. IBM, Samsung and Globalfoundries – members of the Common Platform alliance – are working with STMicroelectronics to develop and standardize advanced, 28nm process technology to ensure consistent production worldwide for electronics and device manufacturers.
The 28nm GF’s chips will use bulk complementary metal oxide semiconductor (CMOS), and high-k metal gate (HKMG) processes. Members of the alliance are driving the global standard for HKMG with their unique “Gate First” technology. The approach is superior to other HKMG solutions in both scalability and manufacturability, offering a smaller die size and compatibility with design elements and process flows from previous technology nodes.
“IBM has extensive experience synchronizing multiple fabs, where we match rigorous manufacturing specifications to critical design parameters. The result is that our advanced technology can be implemented in many fabs around the world and produce the same results, providing clients with multiple suppliers for their product designs, ,” said Gary Patton, vice president for IBM's Semiconductor Research and Development Center
The members of the common platform alliance and STMicroelectronics will optimize the processes and tooling at all the respective manufacturing lines, or fabs, to ensure the chip designs can be produced with the same functional and electrical results at each of the companies.