News
 

Bookmark and Share

(0) 

The Wireless USB (WUSB) promoter group has announced the completion of the Wireless USB 1.1 specification, the technical guideline for product developers to bring the next generation of Wireless USB products to the market. The specification that was originally scheduled to arrive in 2008 is more than two years late. The new spec delivers better performance, lower power and other improvements.

Wireless USB 1.1 delivers "key performance enhancements" to WUSB technology, as well as added UWB upper band support for frequencies of 6GHz and above, and offers backward compatibility with Wireless USB products currently in use by consumers. Wireless USB is evolving with optimized power efficiency and ease of use, lower idle power requirements and improved battery life. Besides, the new association model offers support for near field communication (NFC) and proximity-based association, making Wireless USB even easier to install and use.

Wireless USB is a wireless personal interconnect technology combining the speed and security of wired high-speed USB with the ease-of-use-of wireless technology. WUSB 3.0 is backward compatible with wired USB, allows users to connect up to 127 devices and currently delivers a bandwidth of up to 480Mb/s at 3 meters and 110Mb/s at 10 meters (there are talks about 200Mb/s support). Wireless USB is based on the WiMedia Alliance Ultra-wideband Common Radio Platform (UWB).

“The Wireless USB 1.1 specification is the next step in Wireless USB technology. Consumers want a fast, easy-to-use solution to wirelessly transfer content from PCs to devices. Wireless USB 1.1 is the solution supporting robust, high-speed wireless connectivity among devices," said Jeff Ravencraft, USB-IF president and chairman.

The Wireless USB promoter group consists of seven companies: HP, Intel Corp., LSI Logic, Microsoft Corp., NEC Corp., NXP Semiconductors and Samsung Electronics.

Tags: USB, Wireless USB

Discussion

Comments currently: 0

Add your Comment




Latest News

Friday, May 17, 2013

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS