News
 

Bookmark and Share

(2) 

Taiwan Semiconductor Manufacturing Company has added yet another production facility into its expansion plans. The fab will cost around enormous $10 billion and will almost double capacities the company will have when it initiates construction in 2014.

TSMC is fighting vigorously against Globalfoundries, a large contract maker of semiconductors backed by the government of Abu Dhabi, in a bid to remain the world’s largest producer of advanced chips on 300mm wafers. This year the firm initiated expansion of its already operating fab 12 and fab 14 manufacturing facilities and also started to build fab 15, which will start initial production in early 2012. But it looks like the most ambitious project is still to be announced.

Apparently, TSMC intends to build yet another giant production facility called fab 16 that will cost it whopping $10 billion dollars and which TSMC intends to start building in 2014, reports China Economic News Service. Unlike current fab 12 and fab 14, the fab 16 will consist of five phases and will take many years to become fully operational. At present exact details about the fab are not known and TSMC naturally does not comment on market rumours, but it is projected that after the fab 16 is fully utilized, TSMC’s total capacity will be approximately 600 thousand 300mm wafers per month.

Combined capacity of fab 12 and fab 14 is scheduled to exceed 240 thousand 300mm wafers per month by the end of this year. When the fab 15 becomes fully operational, TSMC's combined 300mm manufacturing capacities will be over 340 thousand 300mm wafers per month, which will let the company to maintain its position of the world's largest contract maker of semiconductors.

Since the fab 16 will have capacity comparable to that of all the previous, it will not only be TSMC’s biggest production facility, but will also likely to be the most expensive semiconductor manufacturing foundry in the world. Considering that TSMC is only projected to start construction of fab 16 in 2014, it is highly likely that the facility will be compatible with 450mm wafers and equipment.

Advanced Technology Investment Company, the company that controls Globalfoundries with AMD, announced plan to build a fab for $6 - $7 billion in Abu Dhabi, the United Arab Emirates.

TSMC did not comment on the news-story.

Tags: TSMC, Semiconductor, Globalfoundries, 300mm, 450mm

Discussion

Comments currently: 2
Discussion started: 12/13/10 05:55:43 PM
Latest comment: 12/14/10 01:07:16 PM
Expand all threads | Collapse all threads

[1-1]

1. 
Now when we're 10yrs in Gigabyte range we have "GigaFabs"?
Why not just stick to MegaFab

Or is it just trendy way to say it these days?
0 0 [Posted by: OmegaHuman  | Date: 12/13/10 05:55:43 PM]
Reply
- collapse thread

 
giga = billion
mega = million
the fab costs 10 billion dollars. its a 10 giga-dollar fab
0 0 [Posted by: taltamir  | Date: 12/14/10 01:07:16 PM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Thursday, May 23, 2013

6:51 pm | OCZ Reveals Vertex 450 Solid-State Drives: High-End Performance at Mainstream Prices. OCZ Introduces New SSDs Based on Indilinx Barefoot 3 Controller

3:40 pm | Nvidia Unveils GeForce GTX 780: GK110-Based Consumer Solution for $649. Nvidia’s Cut Down Titan LE Becomes GeForce GTX 780

Wednesday, May 22, 2013

11:59 pm | Be Quiet: All Current Power Supplies Are Ready for Core i “Haswell”. Be Quiet Claims Top-to-Bottom Compatibility of PSUs with New Intel Chips

11:51 pm | OCZ Partners With Netgear to Deliver Flash-Based Data Center Storage in a Box Functionality to SMBs. Leading OCZ Enterprise-Class Deneva 2 SSDs Now Qualified on Netgear's ReadyDATA 516 NAS Device

11:07 pm | Half of the World’s Population Will Be Covered by 4G/LTE Networks by 2018 - Research. More Than 1 in 2 People Will Be Covered by 4G/LTE-FDD by 2018

9:38 pm | Sony Starts Manufacturing of PlayStation 3 in Brazil. Sony Begins to Make PS3 Game Consoles in Latin America

9:11 pm | Nvidia Grid Unleashes Graphics for Virtualized Desktops. Nvidia and Citrix Commercializes Grid Technology for Virtualized Desktops

8:57 pm | MIT Scientists Mix Graphene with Hexagonal Boron Nitride to Create New Material for Computer Chips. Researchers Create New Material for Semiconductors

8:43 pm | Intel Can Enable a Successful $200 PC in the Age of the Media Tablet – Analysts. Market Observers Mull Viability of $200 PCs on Current Market

8:09 pm | Microsoft Not Worried About Xbox One’s Lack of Backwards Compatibility, Vows Big Xbox 360 Announcement at E3. Microsoft Believes Xbox One Will Not Require Games of Xbox 360

7:52 pm | Asrock’s A-Style Mainboards Set to Be Waterproof. Asrock’s New Intel 8-Series Mainboards to Feature Conformal Coating

7:35 pm | Nvidia Announces PhysX and APEX Support for Microsoft Xbox One. Microsoft Xbox One Games to Use PhysX and APEX