News
 

Bookmark and Share

(1) 

Toshiba Corp. and Sony Corp. have announced that they had signed a non-binding memorandum of understanding expressing their intent to transfer from Toshiba to Sony the semiconductor fabrication facilities owned by Toshiba and operated by Nagasaki Semiconductor Manufacturing Corp. (NSM), a joint venture among Toshiba, Sony and Sony Computer Entertainment, and, following the contemplated transfer, terminate their NSM joint venture relationship.

NSM, which was established in March 2008 and is located in the Nagasaki Technology Center of Sony Semiconductor Kyushu Corp. (SCK), has been manufacturing the high-performance Cell processor, the graphics engine RSX and other high-performance semiconductors and leading-edge SoC (system-on-a-chip) for applications in digital consumer products of Toshiba and Sony. The facilities to be transferred would be the fabrication facilities and equipment for the 300mm wafer line located within the Nagasaki Technology Center purchased by Toshiba from Sony and SCK and leased to NSM in 2008 and other facilities that Toshiba and Sony will agree to transfer among those in which Toshiba invested in connection with the operation by NSM after the purchase.

After due diligence on the facilities to be transferred and continuing negotiations, Toshiba and Sony aim to execute definitive agreements (with respect to the contemplated transfer of the semiconductor fabrication facilities) as soon as possible before the end of the fiscal year ending March 31, 2011. Thereafter, Toshiba and Sony aim to complete the transfer early in the fiscal year ending March 31, 2012, subject to any necessary government approvals.

 

Tags: Toshiba, Sony, Semiconductor

Discussion

Comments currently: 1
Discussion started: 12/29/10 05:14:14 PM
Latest comment: 12/29/10 05:14:14 PM

[1-1]

1. 
It's ours! No! It's mine! Oh no you don't! It's mine! No, It's mine! Ok ... It's yours
0 0 [Posted by: East17  | Date: 12/29/10 05:14:14 PM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015