News
 

Bookmark and Share

(1) 

Advanced Micro Devices and Globalfoundries have changed their wafer supply agreement that describes terms based on which AMD acquires chips from its contract maker of semiconductor partner. The amendments were made after Globalfoundries have to delay manufacturing of chips using 32nm process technology due to technical challenges, which materially impacted AMD's business performance.

The primary effect of the amendment was to change the pricing methodology applicable to wafers delivered in 2011 for AMD microprocessor and accelerated processing unit (APU) products. The amendment also modifies AMD's existing commitments regarding the production of certain graphics processing unit (GPU) and chipset products at Globalfoundries. Pursuant to the amendment, Globalfoundries has committed to provide AMD with, and the latter have committed to purchase, a fixed number of 45nm and 32nm wafers per quarter in 2011. AMD will pay Globalfoundries a fixed price for 45nm wafers delivered in 2011. AMD's price for 32nm wafers will vary based on the wafer volumes and manufacturing yield of such wafers. In addition, AMD also agreed to pay an additional quarterly amount to GF during 2012 if GF meets specified conditions related to continued availability of 32nm capacity as of the beginning of 2012. AMD expects Globalfoundries will meet the conditions to earn these payments.

"The renegotiation of this agreement had been underway since last year when technical challenges delayed GF's 32nm implementation. Recall that because of the trouble Globalfoundries was having with its launch of the 32nm manufacturing process, AMD was forced to delay the release of the Llano product line from last year to this. 'During that time, AMD had continued to pay for 32nm wafers under the original agreement despite the lack of good chips. AMD received far less than it would have reasonably expected from GF in 2010, so in that sense it overpaid for chips,'' said JoAnne Feeney, an analyst with Longbow Research, reports EETimes web-site.

For 2012, pursuant to the amended wafer supply agreement, AMD will resume compensating GF on a cost-plus basis to manufacture the wafers for its microprocessor and APU products.

AMD estimates that it will pay Globalfoundries approximately $1.1 to $1.5 billion in 2011 and $1.5 to $1.9 billion in 2012 for wafer purchases under the wafer supply agreement, as amended. In 2010, AMD paid GF approximately $1.2 billion for wafer purchases. AMD based its 2011 and 2012 estimated costs in part on our current expectations regarding GF’s manufacturing yields and wafer volumes. These costs could increase or decrease as a result of variations in those yields and several other factors including AMD's expectations regarding demand for its products.

"This agreement gives GF an opportunity to improve its chances of winning foundry business away from competitors such as TSMC. The semiconductor community is viewing GF with caution and is watching to see how well it performs in serving its main customer, AMD, and in launching new manufacturing technology nodes. This contract also allows GF to further signal that it has solid confidence in its ability to ramp 32nm to mature yields rapidly, and, by implications, that it can do the same for 40nm and 28nm nodes,'' added Ms Feeney.

Tags: AMD, Globalfoundries, Semiconductor, 32nm, 28nm, 45nm, ATIC

Discussion

Comments currently: 1
Discussion started: 04/04/11 08:49:48 PM
Latest comment: 04/04/11 08:49:48 PM

[1-1]

1. 
They do not need to improve anything.The chips are flawless.
0 0 [Posted by: twainamd  | Date: 04/04/11 08:49:48 PM]
Reply

[1-1]

Add your Comment




Related news

Latest News

Friday, May 17, 2013

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS