News
 

Bookmark and Share

(6) 

At the annual meeting, PCI special interest group (PCI SIG) announced plans to develop a PCI Express-based interconnection standard for external devices. The standard will directly compete against Thunderbolt (co-developed by Apple and Intel), its successors as well as USB 3.0.

The proposed external PCI Express specification is projected to be based on the PCIe 3.0 technology and will support four lanes with transfer speed of up to 32Gb/s, according to EETimes. Initially, the interconnection will use copper wires, but eventually, as the speeds get higher and when the technology adopts the PCI Express 4.0 protocol, wires may be changes to optical. Naturally, the future flavours will challenge not only Thunderbolt with its 10Gb/s interconnection, but also its successors.

"This will help proliferate PCI Express into new business opportunities. Right now we see a need from our members," Yanes said, declining to comment on Thunderbolt directly. There are solutions [like this] in the industry - Thunderbolt is one of them, and some companies are doing own thing," said Al Yanes, president of the PCI SIG.

Unfortunately, the cabled PCIe 3.0 will not support devices with power consumption higher than 20W, which means that it will be impossible to implement external graphics cards into the power envelope of one port (it is physically possible while utilizing several ports with separate power supply circuitry) and therefore the connector will only support mass storage devices, e.g., SSDs, flash sticks, cameras, etc.

"The big issue here is proprietary versus industry standard. It is not clear third parties will have access to Thunderbolt on the same basis they get access to PCI Express," said Nathan Brookwood, the head of Insight64 analyst firm.

Details of the new standard will be defined by a working group now being formed. The group is expected to deliver a standard system makers can implement in products before June 2013. Developers have been working within SIG for several years now over external implementation of the PCIe, something the standard was not tailored for.

In spite of overkill speeds even for 2013, the PCI SIG wants to position its external PCIe 3.0 for consumers. The reason for that is to enable thinner devices with higher speed cable interconnection. It is in question, whether by 2015 there will be no wireless networks to transfer data at decent speeds, considering the fact that multi-Gb/s networks are available now.

"The motivation for the PCIe cable wasn’t spawned due to Thunderbolt, it was more about the shift to thin notebooks and tablets that means you just can't mechanically package things the same way we used to. Thunderbolt was interesting, but it did not solve the problems we have the way we want to have them solved," said one source close to the effort who asked not to be named.

Tags: PCI Express, Thunderbolt, Intel Apple, PCI

Discussion

Comments currently: 6
Discussion started: 06/22/11 07:17:55 PM
Latest comment: 06/12/12 12:50:57 AM

[1-6]

1. 
the sooner it starts selling corning clearcurve fiber the better.
0 0 [Posted by: 457r4l  | Date: 06/22/11 07:17:55 PM]
Reply

2. 
Intel plans to make super computers consume only 20 Watts of power by 2018

Super computers right now will become portable little packages
0 2 [Posted by: seronx  | Date: 06/22/11 08:16:09 PM]
Reply

3. 
I really do not want any new form of copper cable.

I would like the Light Peak was just released (with optical cable) and it became THE single standard.
0 2 [Posted by: tafreire  | Date: 06/23/11 08:51:57 AM]
Reply

4. 
External graphics cards would be great. Hopely future labtop's powers have also "add on" cable to external graphics cards and that way gives more power to PCIe devices.
2 0 [Posted by: MJones  | Date: 06/25/11 12:07:39 AM]
Reply

5. 
Why cant you just make a cable plug that plugs into the pcie slot and have a portable pcie bay that i could mount on top of my computer that i can plug my video cards in. So that i can see my video cards. Because we all buy awesome looking video card but then once they go in we never see them again till we clean them they should have made the pcie slot upside down from its current implementation. I have 2 gtx 460 sli'ed and i feel like i am always hiding them. it would also be easier to keep them and other components cool especially for overclockers. Like me.
0 0 [Posted by: Shaglocc  | Date: 11/07/11 05:44:09 PM]
Reply

6. 
hmmm ,

PCI 3.0 and 4 lanes that means equivalent for

PCI 2.0 and 8 lanes , right ? and the AMD 7750 consumes 55 wat , and it wont be too much hurt by the x8 lanes , but still i would love for this technology to talk its time and saturate and give us optical fiber , that will be awesome and provides all the speed necessary
0 0 [Posted by: medo  | Date: 06/12/12 12:50:57 AM]
Reply

[1-6]

Add your Comment




Latest News

Friday, May 17, 2013

11:57 pm | 4K Ultra-High Definition TVs Set to Become New Standard – Report. 4K Ultra-High Definition TVs Set to Become New Standard – Report

11:50 pm | Sales of Nintendo Wii U Hit Another Low in the U.S. Nintendo Wii U Just Cannot Become Popular

Thursday, May 16, 2013

11:41 pm | Dell Admits Windows 8 Did Not Meet Expectations, Pins Hopes on “Blue” Updates. Dell Disappointed with Windows 8, But Believes in the Future

10:59 pm | AMD Needs More Than Game Console Design Wins to Offset PC Market Declines – Analysts. AMD Has to Develop Competitive Product Lineup to Survive in Current Environment

10:33 pm | Corning Introduces Corning Lotus XT Glass for High-Performance Displays. Corning Advances Glass Substrate for High-Performance Displays

9:51 pm | True Stereo-3D Will Require 330MP – 3.3GP Resolutions, Says Developer of 8K Video Format. NHK: 8K Is the Final 2D Format, All Future Formats Will Be in 3D

9:41 pm | Innodisk Begins to Ship DDR4 RDIMM Samples to Server Makers. Independent DIMM Supplier Samples DDR4 RDIMMs

8:56 pm | Samsung Develops 45nm Embedded Flash Logic Process Technology. Samsung Successfully Tests 45nm Embedded Flash Logic Manufacturing Tech

7:57 pm | NHK Shows World’s First 8K Movie at Cannes Film Festival. Japanese National Broadcasting Company Demos 8K Movie, Content to Film Industry

7:27 pm | Intel’s Paul Otellini: Lack of Chip for iPhone, iPad Was My Worst Mistake. Intel’s Outgoing CEO Regrets About Mission Opportunities with Apple iOS