News
 

Bookmark and Share

(8) 

Taiwan Semiconductor Manufacturing Company on Monday held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for phase 5 of its Fab 14 GigaFab. When the factory is completed in two years from now, it will produce chips using 20nm process technology.

TSMC's 20nm technology is scheduled to begin volume production at TSMC's Fab 12 phase 6 next year. The Fab 14/phase 5 facility will be TSMC's second 20nm-capable fab, scheduled to begin volume production in early 2014. Combined with the planned Fab 14 phase 6, total cleanroom area will reach 87 000m2 square meters, four times larger than a typical 300mm fab – and will further strengthen TSMC's global competitiveness in advanced technologies. Building on TSMC's 28nm technology, TSMC also expects to launch its 20nm technology ahead of foundry peers.

“Our mission is to be the trusted technology and capacity provider of the global logic IC industry for years to come. In fulfilling this mission, we further solidify TSMC and Taiwan's indispensable position in the world semiconductor industry. This groundbreaking for Fab 14, phase 5 represents TSMC's capability to develop leading-edge technology, build advanced capacity, and satisfy customer demand. It also lays the foundation for TSMC's next wave of growth,” said Morris Chang, said chairman and chief executive officer of TSMC.

 

Fab 14 is TSMC's second 300mm fab following Fab 12 phase 1 facility that began volume production in 2004. With phases 1, 2, 3 and 4 now in operation, Fab 14 has capacity of 550 thousand 300mm wafers per quarter, making it the world's largest 300mm fab. The output of Fab 14 phases 1 through 4 has an estimated annual revenue of $6 billion, and TSMC expects the combined annual revenue of phases 5 and 6 to reach a similar scale.

Fab 14 phase 5 will also follow in the footsteps of Fab 14 phases 3 and 4 to apply for “gold” level certification under the U.S. leadership in energy and environmental design (LEED) green building standard, making Fab 14 Taiwan's leading green production facility and largest green campus.

Currently Fab 14 is staffed by approximately 4600 employees, and the expansion of the facility will create another 4500 high-quality job opportunities.

Tags: TSMC, Semiconductor, 20nm, 28nm, 300mm

Discussion

Comments currently: 8
Discussion started: 04/11/12 12:18:51 AM
Latest comment: 04/12/12 03:20:32 PM
Expand all threads | Collapse all threads

[1-3]

1. 
too late
1 1 [Posted by: visz963  | Date: 04/11/12 12:18:51 AM]
Reply
- collapse thread

 
lol, like anyone has 20nm fabs, TSMC should start production 2013
0 0 [Posted by: madooo12  | Date: 04/11/12 04:13:44 AM]
Reply

2. 
Nvidia will complain on this faulty new node again... I surely bet. =p
0 1 [Posted by: pogsnet  | Date: 04/11/12 05:38:44 AM]
Reply
- collapse thread

 
haters gonna hate
2 1 [Posted by: veli05  | Date: 04/11/12 07:16:54 AM]
Reply

3. 
show the post
0 3 [Posted by: beenthere  | Date: 04/11/12 06:15:49 AM]
Reply
- collapse thread

 
Given how expensive 28nm transition has been for GPU makers (i.e., them selling 300-365mm^2 chips to us for $500-550), it would be prudent to wait at least 2 years before launching a new generation of cards on 20nm in ample volume and at reasonable prices.

28nm generation has just started. We can discuss the cost effectiveness of 20nm in 1.5-2 years. Further, sooner or later the industry will transition to 450mm wafers from 300mm wafers, which should help to keep costs in check somewhat.

As 28nm process matures, AMD and NV should be able to release faster clocked GTX780/HD8790 series.
0 0 [Posted by: BestJinjo  | Date: 04/11/12 11:27:55 AM]
Reply

[1-3]

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones