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Soitec, a leading designer of materials for semiconductors, has announced its fully depleted (FD) product roadmap comprising two products designed for both planar and three-dimensional (FinFET) approaches to building transistors. Industry checks by X-bit show that AMD, Globalfoundries and some other companies are interested in FDSOI for 20nm chips.

"Our fully depleted product roadmap addresses the critical needs of the semiconductor industry and solves key challenges facing manufacturers today. Whichever path chip vendors choose to follow – planar or FinFET – Soitec provides solutions that address cost, performance, power-efficiency and time-to-market issues. FD-2D enables immediate and significant performance leaps, while FD-3D makes FinFET a reality for the entire industry at accelerated schedules and reduced risk," said Paul Boudre, chief operating officer of Soitec.

Based on industry checks, X-bit labs believes that Globalfoundries and other partners will use fully-depleted SOI with its 20nm processes and more advanced technologies for making chips, including those designed by Advanced Micro Devices.

Fully-depleted wafers from Soitec, pre-integrate critical characteristics of the transistor within the wafer structure itself. Soitec’s FD wafers offer an early, low-risk migration at the 28nm node down to 10nm and beyond, lowering costs and enabling significant advances in the performance and power efficiency of mobile devices such as smartphones and tablets.

Soitec’s FD-2D product line enables a unique planar approach to fully depleted silicon technology as early as the 28nm node, in which chipmakers can continue to leverage their existing designs and process technologies. FD-2D also enables immediate gains in performance and energy efficiency for mobile and consumer multimedia chips.

The company’s FD-3D product line facilitates the introduction of three-dimensional (FinFET) architectures with reduced time and investment, and drives substantial simplifications in the transistor fabrication process, targeting nodes below 20nm.

Soitec’s proprietary Smart Cut layer transfer technology is said to generate thin layers with high quality and uniformity, bringing the ability to tune starting wafers to successive technology nodes and delivering key advantages as chip manufacturers pursue the best performance, efficiency and manufacturability results.

Tags: AMD, Globalfoundries, Semiconductor, Soitec, 20nm, 14nm

Discussion

Comments currently: 22
Discussion started: 04/28/12 10:35:07 AM
Latest comment: 04/30/12 03:58:40 PM
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1. 
GloFo is likely moving to stacked chips for 20nm so this should offer many options.
5 7 [Posted by: beenthere  | Date: 04/28/12 11:10:26 AM]
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2. 
AMD said it will drop SOI. They want to spend less time and money on developing new CPUs. Insteand hire new engineers, they decided to drop SOI.
1 1 [Posted by: Tristan  | Date: 04/28/12 11:37:26 AM]
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- collapse thread

 
Intel dropped SOI too, I think you need to get an understanding of what SOI is, and how effective it is at the ever decreasing size of transistors, as well as the cost of SOI at such small sizes. Intel, for example dropped SOI for FinFET at 22nm with Ivy Bridge.
2 1 [Posted by: mmstick  | Date: 04/29/12 05:51:04 AM]
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show the post
0 3 [Posted by: hkultala  | Date: 04/29/12 08:30:14 AM]
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it used a similar technology called TeraHertz http://en.wikipedia.org/wiki/Intel_TeraHertz
0 1 [Posted by: madooo12  | Date: 04/29/12 09:08:20 AM]
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no, what AMD actually said is it will use bulk manufacturing for its CPU's in the future instead of a custom process, starting with 28nm.

what this news means for that is the 20nm and lower node it will be using a version of SOI again. but not for the 28nm versions.
1 0 [Posted by: Countess  | Date: 04/29/12 06:35:22 PM]
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3. 
It would be good if they hire new engineers.
They have to, seriously....
2 2 [Posted by: Pouria  | Date: 04/28/12 01:57:41 PM]
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Just what is so bad with their current engineers? They have been doing a great job with their low R&D budget, which is significantly lower than Intel's by the way, yet able to produce some really interesting stepping stones for the future of processor design, especially with help from IBM. The only thing to note about Intel engineers is that they have money flowing out the wazoo so they can use brute force design techniques, something AMD doesn't have the money to do.
6 1 [Posted by: mmstick  | Date: 04/29/12 05:54:57 AM]
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for the future of processor design....
aha; the future is fusion... since Im not sure 2006-7

How many times am I stuck with ATi(Actually AMD) Drivers (Rage blue textures just for example)?... They have software engineers for writing drivers don't they?
Don't you want High-End x86 based processors From AMD?
You want....just sit and wait for Heterogeneous computing, so then MAYBE Radeon or GCN or whatever else from past-ATi helps AMD kick back?
Now, look at there with Intel teasing and has lots of faults of course; Ivy-bridge Heating problem for example....
Are you saying that the ARCHITECTURE and thus the weakness of Bulldozer exist because of AMD's Watchman or someone?
Sure bad managements before, and sure bad engineering then.
They did things, bring new Cores that most x86 engineers say they are not true Cores and with that they didn't actually do the job with giant software developers' engineers (too late dude,Damage is done.). AND by now AMD is almost or completely fund-less, so the only power they could have is to bring brains
They had to hire both Hardware and Software engineers for good. It's just my opinion 'Cause I think we used to saw some useful innovations from AMD from time-to-time.
0 2 [Posted by: Pouria  | Date: 04/29/12 04:36:12 PM]
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4. 
I screamed this for months at Tomz. The materials people said BULK is done at 14nm. AMD is not moving to BULK for anything but Brazos. Why do people think that GF doesn't have an SOI 28nm HKMG node process?
I have yet to hear the words, "Trinity, Kaveri and OIpteron will be BULK."
1 0 [Posted by: BaronMatrix  | Date: 04/30/12 03:58:40 PM]
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