Qualcomm, the world's largest supplier of chips for mobile devices, may contract Globalfoundries, in addition to Samsung Semiconductor, Taiwan Semiconductor Manufacturing Co. and United Microelectronics Corp. to make chips using 28nm process technology.
Earlier this year Qualcomm announced plans to outsource manufacturing of chips originally produced at 28nm node at Taiwan Semiconductor Manufacturing Company to other foundries after TSMC failed to fulfill Qualcomm's demand for the latest Snapdragon S4 family of products. Early in July, it transpired that Qualcomm had approached Samsung Semiconductor and UMC to make its chips using 28nm manufacturing process.
According to a report from Commercial Times news-paper (which report was partly translated by DigiTimes web-site), Globalfoundries has also landed orders to make chips for Qualcomm at 28nm node. Theoretically, it is possible to make chips using 28nm-LPH fabrication process both at Globalfoundries and Samsung Semiconductor, as both foundries belong to the same industry alliance; hence, it is in Qualcomm's interests to contract both contract makers of semiconductors.
What should be noted, is that Globalfoundries and Qualcomm back in 2012 entered into a non-binding memorandum of understanding to collaborate on leading edge technologies, such as 45nm low power and 28nm LP with an intended collaboration on future advanced process nodes. Therefore, it is logical for Qualcomm to contract GF, which is why it was surprising that several weeks ago the rumours only pointed to Samsung and UMC.
Globalfoundries and Qualcomm did not comment on the news-story.