News
 

Bookmark and Share

(0) 

Two leading contract makers of semiconductors - Globalfoundries and IBM - will utilize the so-called high productivity combinatorial (HPC) technology developed by Intermolecular to speed up development of manufacturing technologies down to the 10nm node.

Intermolecular’s combinatorial technology allows many more tests to be done using a single wafer. This enables experimental data to be generated and analyzed with significantly greater speed and efficiency than a traditional development line, accelerating innovation in materials, processes, and device architectures.

HPC approach to R&D utilizes advanced combinatorial processing systems that allow dozens or even hundreds of experiments to be conducted in parallel, while Informatics software and analytical methods quickly scan the results for the most promising materials and unit process candidates. Process development and device integration take place simultaneously, so that manufacturability considerations are taken into account from the outset, instead of late in the R&D process. As a result, semiconductor and clean energy companies, as well as their equipment and materials suppliers, get better return on their R&D investment.

“IBM and Globalfoundries are committed to pushing forward the leading-edge of IC logic manufacturing with new materials and device structures. Intermolecular’s HPC technology will help to more rapidly explore materials and processing options for advanced logic manufacturing,” said Gary Patton, vice president of semiconductor research for IBM.

It is expected that Intermolecular HPC approaches and workflows will help Globalfoundries and IBM to solve a range of challenges, including next-generation memory technologies (phase change, resistive RAM, etc.), next-generation logic devices (III-V, graphene, etc.) and other.

“Our business model is built on collaboration, both in customer engagements and technology development. Collaborating with Intermolecular has strengthened our R&D pipeline and improved R&D efficiency,” commented David Bennett, vice president of alliances for Globalfoundries.  

Tags: IBM, Lenovo, Intermolecular, Semiconductor, 10nm, 14nm

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones