Bookmark and Share


Taiwan Semiconductor Manufacturing Co. has revealed its process technology migration roadmap last week. As it appears, the company will keep its tactic with 20nm and will only offer one version of process tech instead of four today.

TSMC intends to deploy mass manufacturing of system-on-chip products using 20nm process technology next year and plans to start risk production of chips using 16nm FinFET fabrication process sometime in November, 2013, which points to mass availability of such chips in 2014 - 2015. Preliminary schedule for 10nm manufacturing technology points to 2016, according to a technology roadmap published by EETimes web-site.

It is noteworthy that TSMC intends to use ARM’s first 64-bit processor, the ARMv8, as a test vehicle for the 16nm FinFET process; the tape out of the first test chip will occur next year. TSMC is expected to have chip design kits for its 16nm process available in January with the first foundation IP blocks, such as standard cells and SRAM blocks ready a month later.

“TSMC’s 16nm FinFET process will be substantially similar to its 20nm high-K metal gate SoC process in the back-end,” said Cliff Hou, vice president of research and development at TSMC.

Recently introduced 14nm-XM offering from Globalfoundries is based on a modular technology architecture that uses a 14nm FinFET device combined with its 20nm-LPM process back-end-of-line (BEOL) interconnect flow. Leveraging the maturity of the 20nm-LPM technology will enable a rapid time-to-market as well as a smooth transition for customers looking to tap the benefits of FinFET system-on-chips, such as lower power consumption and higher performace, as soon as possible.

Tags: TSMC, Semiconductor, 20nm, 16nm, 10nm, FinFET


Comments currently: 11
Discussion started: 10/22/12 09:17:54 AM
Latest comment: 08/22/16 08:03:24 AM
Expand all threads | Collapse all threads


Title should be "laid" process technology roadmap out. Its a hard verb to conjugate.
0 0 [Posted by: cashkennedy  | Date: 10/22/12 09:17:54 AM]
- collapse thread

show the post
0 5 [Posted by: BestJinjo  | Date: 10/22/12 03:35:58 PM]

show the post
0 8 [Posted by: beenthere  | Date: 10/22/12 10:38:45 AM]
- collapse thread

More efficient process. You do not know what you are talking about. If you mean more efficient as in the steps to make smaller scales, then OK. A more efficient processor relates to how it is engineered. The smaller fab process only gives a small percentage of performance. Smaller fab process generates more chips per silicon disc, so that is the advantage of going smaller. Sure stating that electrons move at the speed of light and that a smaller process is better for performance still performance is small like micro boost in performance.

TSMC is rushing smaller process is because to compete against Intel and Global Foundries. If they do not they will lose.
3 0 [Posted by: tecknurd  | Date: 10/22/12 12:02:31 PM]


Add your Comment

Related news

Latest News

Wednesday, November 5, 2014

10:48 pm | LG’s Unique Ultra-Wide Curved 34” Display Finally Hits the Market. LG 34UC97 Available in the U.S. and the U.K.

Wednesday, October 8, 2014

12:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

4:22 am | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

1:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

10:41 am | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture