News
 

Bookmark and Share

(2) 

Taiwan Semiconductor Manufacturing Co. is set to start experimental production of chips for Apple already this quarter, according to a media report. The collaboration between the world’s largest contract maker of chips and the major consumer electronics company was widely expected, but it was suggested that the two firms will only team up sometimes in late 2013 – early 2014 timeframe.

TSMC will produce Apple A6X application processor with two Apple Swift general-purpose cores (believed to be derived from ARM Cortex-A15, ARMv7-compatible), PowerVR SGX 554MP4 graphics sub-system with four GPU domains as well as dual-channel LPDDR2 memory controller. According to Commercial Times, TSMC utilizes one of its 28nm process technologies to produce the system-on-chips for Apple, most probably HKMG-based CLN28HPL or CLN28HPM versions.

Since TSMC uses gate-last approach to high-K metal gate technology (HKMG), it is unlikely that the A6X chips produced using 28nm at TSMC will be considerably smaller [and hence cheaper to make] compared to A6X application processors made by Samsung Electronics using 32nm (32LP) fabrication process as the latter uses gate-first HKMG approach to minimize die size. Had Apple wanted to lower power consumption or improve performance of A6X, it would have chosen Samsung’s 28LPP or 28LPH manufacturing technologies, especially due to remarkably simple migration path from Samsung’s 32LP node. Considering the lack of major advantages TSMC can provide Apple at the moment, the production is just an experiment, which should show Apple advantages and disadvantages of working with TSMC in general.

Based on the results of the trial production of A6X application processors at TSMC, Apple will likely make its decisions about further options in regards of contract chip manufacturing. Apple presently produces all of its SoCs at Samsung Electronics, which has never let the company down, but which is its major rival on the market of smartphones and tablets. TSMC does not compete with Apple, but it has too many large customers (AMD, Nvidia, Qualcomm, etc.) who demand high-volumes of chips produced using leading-edge process technology that Apple should better think twice before relying completely on TSMC, who had problems fulfilling production demands in the past.

Apple and TSMC did not comment on the news-story.

Tags: Apple, Samsung, TSMC, Semiconductor, ARM, Cortex, 28nm, 32nm, PowerVR

Discussion

Comments currently: 2
Discussion started: 01/06/13 06:06:05 PM
Latest comment: 01/07/13 09:20:32 AM

[1-2]

1. 
Another case of Apple cutting their nose despite their face.

Samsung is the best Mfr of the Apple processor as well as the Apple displays but Apple is is going to move to someone other than Samsung anyway.

I think their test is going to kill battery life just so Apple can move it's production from the best.

If I were Samsung I would put Apple on A6 production allocation as well as Display (retina for the iPad4) production allocation especially given the demand for higher resolution displays for smartphones across the industry.

Samsung already has it in full production and is sitting pretty.
1 0 [Posted by: fdunn  | Date: 01/06/13 06:06:05 PM]
Reply

2. 
So apples will become even more rotten products that they already are. New motto should be: *No more overheating from AXX SoC - AXX SoC is DOA*
0 0 [Posted by: OmegaHuman  | Date: 01/07/13 09:20:32 AM]
Reply

[1-2]

Add your Comment




Related news

Latest News

Tuesday, July 15, 2014

6:11 am | Apple Teams Up with IBM to Make iPhone and iPad Ultimate Tools for Businesses and Enterprises. IBM to Sell Business-Optimized iPhone and iPad Devices

Monday, July 14, 2014

6:01 am | IBM to Invest $3 Billion In Research of Next-Gen Chips, Process Technologies. IBM to Fund Development of 7nm and Below Process Technologies, Help to Create Post-Silicon Future

5:58 am | Intel Postpones Launch of High-End “Broadwell-K” Processors to July – September, 2015. High-End Core i “Broadwell” Processors Scheduled to Arrive in Q3 2015

5:50 am | Intel Delays Introduction of Core M “Broadwell” Processors Further. Low-Power Broadwell Chips Due in Late 2014

Wednesday, July 9, 2014

4:04 pm | Intel Readies New Quark “Dublin Bay” Microprocessors. Intel’s “Dublin Bay” Chips Due in 2015