Bookmark and Share


Taiwan Semiconductor Manufacturing Co. expects demand for its next-generation 20nm manufacturing technology to be even higher than the demand for its current-gen leading-edge 28nm fabrication process. The company hopes it will be able to meet the demand thanks to simultaneous launch of two manufacturing facilities capable of 20nm.

“We think that our volume of 20nm SoC next year, 2014, will be greater than the volume of 28nm last year and we think the volume of 20nm SoC in 2015 will be greater than the volume of 28nm this year,” said Morris Chang, chief executive officer and chairman of TSMC, during a conference call with financial analysts.

TSMC now produces its 28nm chips at Fab 15 phase 1 and 2. TSMC began equipment move-in for the phase 1 facility in June 2011 and started volume production of 28nm technology products for customers in October, 2011. The phase 2 of Fab 15 was completed in Q4 2012 and this was supposed to boost total 28nm capacity to reach about 50 thousand wafers per month. The Fab 15 phase 3 and phase 4 will manufacture chips using 20nm manufacturing process starting from the second half of 2013. TSMC is also constructing phase 3 and phase 4 of Fab 15 in parallel, which will allow it to start 20nm production simultaneously and dramatically boost its leading-edge production capacities.

Since TSMC will only offer one version of 20nm fabrication process (vs. four versions of 28nm manufacturing technology), it will take shorter amount of time to ramp up volume production of chips using the technology.

The head of TSMC declined to comment whether the cost of manufacturing at 20nm will be significantly higher compared to the cost of production at 28nm. Still he said that the vast majority of customers are interested in transition to 20nm fabrication process.

Tags: TSMC, 20nm, Semiconductor, 300mm, 28nm


Comments currently: 1
Discussion started: 01/22/13 10:08:58 AM
Latest comment: 01/22/13 10:08:58 AM


Everybody is moving to low voltage so 20nm will be popular as will 14nm. The performance and power gains below the 28nm node however are going to be diminishing in returns. They can pack more transistors in a smaller package so that is good and it will be the primary means to improve system performance some.
0 1 [Posted by: beenthere  | Date: 01/22/13 10:08:58 AM]


Add your Comment

Related news

Latest News

Wednesday, November 5, 2014

10:48 pm | LG’s Unique Ultra-Wide Curved 34” Display Finally Hits the Market. LG 34UC97 Available in the U.S. and the U.K.

Wednesday, October 8, 2014

12:52 pm | Lisa Su Appointed as New CEO of Advanced Micro Devices. Rory Read Steps Down, Lisa Su Becomes New CEO of AMD

Thursday, August 28, 2014

4:22 am | AMD Has No Plans to Reconsider Recommended Prices of Radeon R9 Graphics Cards. AMD Will Not Lower Recommended Prices of Radeon R9 Graphics Solutions

Wednesday, August 27, 2014

1:09 pm | Samsung Begins to Produce 2.13GHz 64GB DDR4 Memory Modules. Samsung Uses TSV DRAMs for 64GB DDR4 RDIMMs

Tuesday, August 26, 2014

10:41 am | AMD Quietly Reveals Third Iteration of GCN Architecture with Tonga GPU. AMD Unleashes Radeon R9 285 Graphics Cards, Tonga GPU, GCN 1.2 Architecture