News
 

Bookmark and Share

(0) 

Flextronics, one of the world’s largest contract manufacturers of electronics, this week unveiled its state-of-the-art product innovation center in Milpitas, California. Flextronics' operations, which are well known in Silicon Valley, have been upgraded with $12 million of equipment and capabilities. The company also announced plans to invest another $20 million in the center in the coming months.

Flextronics has installed the most advanced 3D plastic printing, surface mount technology (SMT) lines, X-ray and test equipment to support major industries in bringing innovative products to market rapidly. Flextronics has also added dedicated customer-confidential work spaces that include increased security and restricted access to protect OEM customer's intellectual property (IP) and confidentiality of new products being launched into the marketplace. The facility will allow small and large customers to make prototypes and/or pre-production samples of advanced devices without leaving California.


A technician configures a ''Pick and Place'' electronics manufacturing machine at Flextronics International. Image by Reuters news-agency.

Flextronics has committed to further invest in existing equipment upgrades and expansion of capabilities including, 3D metal printing, CNC machining, anodizing, advanced automation, microelectronics packaging and RF technologies. 

"Flextronics is committed to providing our OEM customers with advanced innovative solutions and offerings that increase their competitiveness and time to market. Flextronics is the leading new product introduction and supply chain solutions company to Silicon Valley OEMs for more than 15 years, and we are thrilled that our new investments will provide even more advanced electrical and mechanical solutions," said Mike McNamara, chief executive officer of Flextronics.

Flextronics Silicon Valley locations include Milpitas, Morgan Hill, San Carlos and San Jose. 

Tags: Flextronics, Apple, Google, Microsoft

Discussion

Comments currently: 0

Add your Comment




Latest News

Friday, May 24, 2013

6:09 pm | Second-Generation Kinect Sensor for Windows Due in 2014 – Microsoft. Microsoft Discloses Additional Details About Kinect 2

4:24 pm | New Technique May Open Up an Era of Atomic-Scale Semiconductor Devices. Atom-Scale Semiconductor Devices May Be Incoming, Thanks to New Researchers

Thursday, May 23, 2013

11:30 pm | Kinect Support Is Not Mandatory for Xbox One Video Games – Microsoft. Microsoft Will Not Require Compulsory Support of Kinect from Xbox One Games

11:20 pm | Thermaltake Publishes List of PSUs Compatible with Intel Cori i “Haswell” Chips. 20 PSUs from Thermaltake Are Compatible with Next-Gen Intel Chips

11:10 pm | European Amazon Stores Start to List Xbox One with €599 Price-Tag. Microsoft Xbox One May Cost €599 in Europe, If First Listings Are Correct

9:28 pm | Apple to Assemble Macs in Texas, Set to Manufacture Parts Across the U.S. Apple’s Plan to Move Production Back to U.S. Gets Shape

9:12 pm | Microsoft Confident in Lack of Quality Issues with Xbox One Hardware. Microsoft Vows Xbox One Will Not Have RROD-Like Issues

8:52 pm | AMD Officially Launches New-Generation APUs for Mobile Applications [UPDATED]. AMD Introduces Kabini, Temash and Richland Accelerated Processing Units

6:51 pm | OCZ Reveals Vertex 450 Solid-State Drives: High-End Performance at Mainstream Prices. OCZ Introduces New SSDs Based on Indilinx Barefoot 3 Controller

3:40 pm | Nvidia Unveils GeForce GTX 780: GK110-Based Consumer Solution for $649. Nvidia’s Cut Down Titan LE Becomes GeForce GTX 780