News
 

Bookmark and Share

(0) 

Taiwan Semiconductor Manufacturing Co. had to evacuate two semiconductor production facilities on Wednesday as at least 6.1 earthquake hit Taiwan. The company says that the alarm triggered automatically and that nobody has been injured, but the world’s largest chipmaker yet has to report about the possible damages to wafers that were in production.

The U.S. Geological Survey recorded the earthquake with a magnitude of 6.3, reports Reuters news-agency. The epicenter of the quake was adjacent central Taiwan at a depth of about 15 km (9 miles), said Taiwan's Central Weather Bureau, which uses the Richter scale. There were no instant reports of casualties or damage. In Taiwan, organizations have to evacuate personnel during earthquakes as strong as 4 on the Richter scale.


TSMC's Fab 12

One fab that was evacuated is located in Hsinchu, the other was fab was in Taichung, reports ElectronicsWeekly.com citing TSMC.  In Hsinchu, Taiwan, TSMC has a number of large facilities, including Fab 12 gigafab that processes 300mm wafers using previous-generation (40nm and older process technologies) as well as numerous 200mm and a 150mm fabs. In Taichung, Taiwan, TSMC operates fab 15 facility, which processes 300mm wafers using advanced process technologies.

A TSMC spokesman reportedly said that workers returned to the fab shortly after the evacuation and that operations are not expected to be affected.

Earthquakes happen regularly in Taiwan, which is located on a seismically active stretch of the Pacific basin. In September 1999, a 7.6 quake killed more than 2400 people, destroyed or damaged 50 000 buildings and stopped a significant part of semiconductor production. In 2010 TSMC lost around 40 thousand 200mm-equivalent wafers in a quake.

Tags: TSMC, Semiconductor, 300mm, 28nm, 40nm, 20nm

Discussion

Comments currently: 0

Add your Comment




Related news

Latest News

Monday, July 28, 2014

6:02 pm | Microsoft’s Mobile Strategy Seem to Fail: Sales of Lumia and Surface Remain Low. Microsoft Still Cannot Make Windows a Popular Mobile Platform

12:11 pm | Intel Core i7-5960X “Haswell-E” De-Lidded: Twelve Cores and Alloy-Based Thermal Interface. Intel Core i7-5960X Uses “Haswell-EP” Die, Promises Good Overclocking Potential

Tuesday, July 22, 2014

10:40 pm | ARM Preps Second-Generation “Artemis” and “Maya” 64-Bit ARMv8-A Offerings. ARM Readies 64-Bit Cores for Non-Traditional Applications

7:38 pm | AMD Vows to Introduce 20nm Products Next Year. AMD’s 20nm APUs, GPUs and Embedded Chips to Arrive in 2015

4:08 am | Microsoft to Unify All Windows Operating Systems for Client PCs. One Windows OS will Power PCs, Tablets and Smartphones