PCI-SIG, the organization responsible for PCI Express input/output (I/O) technology, has announced that it is enabling the mobile industry with the delivery of its Mobile PCI Express (M-PCIe) specification and its new M.2 specification, a next-generation form factor for ultra-light and thin platforms.
PCI-SIG’s M-PCIe specification extends PCI Express architecture to the mobile industry, bringing decades of PC innovations to emerging ultra-thin and light mobile devices. The specification enables PCI Express architecture to operate over the MIPI Alliance M-PHY physical layer, a proven technology that meets the low-power needs of handheld devices. The M-PCIe specification provides uncompromised scalable performance while delivering a consistent user experience across multiple mobile platforms.
“The mobile industry has embraced the MIPI Alliance M-PHY physical layer specification as a proven technology to meet the high performance and low power needs of tablets and smartphones. Our collaboration with the PCI-SIG on the new M-PCIe specification will provide users the best of all worlds, drastically reduced product development and validation cycles and access to a truly mobile focused physical layer interface technology,” said Joel Huloux, chairman of the MIPI Alliance.
The M.2 specification delivers flexibility to support high-end performance as well as provide scalable performance to power-constrained devices as required. The specification is designed as a tunable I/O technology for developers to create the perfect balance of power and performance. It provides a natural transition from the Mini Card and Half Mini Card to a smaller form factor in both size and volume, thereby supporting multiple technologies including Wi-Fi, Bluetooth, SSD and WWAN.
“Each new technical innovation is a testament to the importance of PCI-SIG, providing our membership and the computing industry with future-focused technology, ensuring that high performance remains one of our top priorities. The addition of M-PCIe technology and the new M.2 form factor to our specification library is another significant step to providing industry-leading I/O technology to all of the markets our members participate in,” said Al Yanes, PCI-SIG president and chairman.
The M.2 specification is currently at revision 0.7a and is anticipated to be released in Q4 2013. The M-PCIe specification is now available on the PCI-SIG website. Implementers of M-PCIe technology must be members of both PCI-SIG and MIPI Alliance in order to leverage member benefits, including access to licensing rights and specification evolutions.