TSMC used to claim that they are the first company to be able to start producing semiconductors using the thinnest 90nm (0.09 micron) manufacturing process (see this news-story). Unfortunately for this contract manufacturer, they now have to take their words back, since they are going to delay the launch of mass-production start.

In fact, this company had numerous problems with 130nm process as well, moreover, it is not yet clear if they do not have them now and the yield is high enough for commercial products. As it was reported a number of weeks back, TSMC had to change the design rules for the manufacturing technology and that has presumably caused the delay in the NV30 launch. Basically, considering the problems emerged with the 130nm technology, it is quite logical for them to review the more advanced process before launching it.

According to the official information, now TSMC will launch its 90nm manufacturing technology only in the second quarter 2003. The allude that they will be able to actually start using it commercially, e.g., some of their partners will develop certain devices for such process.