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Intel representatives reported yesterday that the company intends to speed up the implementation of 0.09micron manufacturing technology. Now according to Craig Barrett, Intel CEO and President, the new technology should be put into life in the beginning of 2003, which is about half a year earlier than it has been initially planned.
In fact, it is not quite clear so far, which of the CPUs Intel is going to move to a finer 0.09micron production technology first. The potential of the new 0.13micron Northwood core for Pentium 4 processors, which should be used starting from January 2002, seems to be more than enough to last Intel for over a year. That is why Intel is very unlikely to move its Pentium 4 family to a new manufacturing technology another time in early 2003. This way, we see the new mobile Banias processor as the most likely candidate to be moved to 0.09micron manufacturing technology in 2003, especially since its mass production is planned for this timeframe.
As for the peculiarities of the new technology, Intel has two versions prepared: P862 and P1262. The first is intended for 8-inch wafers, and the second one – for 300mm wafers. It will be using copper interconnects, low-k dielectrics, etc.
In conclusion we would like to remind you of Intel’s plans concerning the implementation of new manufacturing technologies:

Due Date19951997199920012003200520072009
Manufacturing TechnologyP854P856P858P860P1262P1264P1266P1268
Micron0.350.250.180.130.090.0650.0450.032

As we can see, Intel is going to stick to the tradition of introducing new manufacturing technology once every two years.

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