- VT8233Link bus (this is a bus between the chipset North and South bridges, which provides 266MB/sec bandwidth), AC’97 codec, 6 USB 1.1 ports, HomePNA, 10/100 Base-T, 2 ATA/100 channels, IO APIC.
Mass production has already started. - VT8233CThis one is similar to the previously described VT8233 South Bridge. However, it will also feature 3Com communicational part.
Engineering samples of the chipsets will be available in this quarter. Mass production is planned for the end of Q2 2001. - VT8235. 8/16bit V-Link, 6 USB 2.0 ports, integrated DSL or Wireless.
Engineering samples are due in Q3 2001. - VT8237. LDT-PCI bridge (LDT, Lighting Data Transport, is a high speed bus developed by AMD), 6 USB 2.0 ports, integrated DSL or Wireless. All the other specs are similar to those of VT8233 (AC’97 codec, HomePNA, 10/100 Base-T, 2 ATA/100 channels, IO APIC).
The first engineering samples should come out in Q4 2001.

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by Anna Filatova
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