Today at the Industry Strategy Symposium Hector Ruiz, president and chief operating officer of AMD, said that the company is planning to open their new 300mm wafer fab for CPU manufacturing in approximately 2004, according to EBN. This will be the third AMD’s fab and it will be known as Fab 35. He also pointed out that this would very likely be a joint venture in order to share the risks and costs of the fab, which could cost in the range of $4 billion. So, AMD is planning this shift to new 300mm wafer technology relatively late, while the shift to 0.13 micron technology is scheduled for the early 2002 and should take place at a Dresden fab.