The new module features 36 256Mbit chips in FBGA package. By using this packaging, they are able to fit memory modules like that into thin servers, which have become so popular recently (the just announced modules fit into 1U rack-mount servers, that is 1.2inch). FBGA package saves about 60% of the module size, as it requires only 96sq.mm instead 262sq.mm for the TSOP package. The additional advantage of FBGA is the reduction of EMI by over 50%, which makes it much easier to make the new modules comply with the PC2700/DDR333 specs demanding higher signal clarity compared with the previous standards. The memory modules work at 2.5V to work and 1.25V to send signals. The engineering samples of the new Infineon products are available for $1300.