Firstly, 12-inch substrates cost more, and secondly, the wafer manufacturing appears more expensive. The preliminary estimates show that the cost of one 8-inch wafer made of regular substrates from silicon dioxide with 0.13micron manufacturing process costs between $1900 and $2250, while the production cost of 12-inch wafer lies between $2900 and $3300. Note that 12-inch wafer allow you to get 2.5 times more dies than an 8-inch one.
The benefits of 12-inch wafers are evident, however, we should also bear in mind that the chips yields in case of a new wafer and new production technology applied should be much lower than those provided by the well-practiced combination of 8-inch and 0.13micron. No wonder that Intel is regarding the possibility to use SOI substrates costing much more than their standard silicon dioxide brothers with a grain of skepticism.
But these are just temporary hardships. With the time, the substrates should go cheaper, the technology will be debugged and as a result the chips yields will grow up. so, Intel still has its benefits all ahead.





