And one more story from JEDEC Committee. During the conference in Santa-Clara (California) the committee shared some preliminary DDR II specifications, which is the second generation DDR SDRAM standard expected to enter the mass market some time in 2004, as we read over here.

In the field of system memory, DDR-II specs are determined by the chips with the resulting frequencies of 400MHz, 533MHz, and 667MHz (600MHz frequency was removed from the list). In the graphics field they pre-defined the following frequencies: 800MHz and 1000MHz.all the chips will work at 1.8V and their capacity will be at least 512Mbit. The packaging should be 200-, 220- and 240-pin FBGA.

DDR II memory will use the same set of instructions but slightly modified and updated. The new DDR II features include: "posted CAS", differential strobe, OCD (off-chip output driver calibration), ODT (on-die termination), burst interrupt and a 4-bit "pre-fetch" instead of the 2-bit one as in DDR I.

The development of DDR II specs will be completed this month and in June they will release the definition of supported chips. In September the committee will offer the first specs for memory modules. All the largest memory makers promised to start the production of DDR II samples in the end of this year or beginning of the next year at the latest.