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At CeBIT VIA showed the following slide demonstrating its vision of the DDR SDRAM’s future:
As you can notice, VIA expects DDR333 (PC2700 for DIMM modules) to stay in the mass market up to the end of 2004, DDR400 (PC3200) to appear in the mass market in the middle of this year and to stay there until the end of 2005. As for DDR400 (later DDR667) of DDR II standard, it is supposed to turn up in the mass market in 2004 and should stay there for two years. By the way, VIA’s suppositions in this respect are comparable to the "DDR SDRAM Roadmap" already mentioned in our news. The only thing I am pretty puzzled about is the "6.4GB bandwidth of DDR667" (it should actually be 5.3GB, while 6.4GB is valid for DDR800 already).
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