Finally, we have received detailed specifications of the SiS330 chip (see this news story) and Xabre family (see this news story), which will be based on this chip (information from 3Dcenter.de website).

First, we would like to add some SiS330 chip specifications, which were taken from the official press-release. They are given below:

• Support of AGP 8x and AGP 3.0 specifications
• 4 pixel pipelines with two texturing units each
• Support of DirectX 8.1 pixel shaders, version 1.3 (SiS "Pixelizer" Engine)
• Optimized T&L block without vertex shaders support
• Compatibility with DirectX 8.1
• Support of Volume Texture, Bump Mapping, Cubic Mapping, BRDF, Shadow Mapping
• Deinterlacing support during video-playback
• Hyper FSAA full-screen anti-aliasing
• Up to 128 MB SDRAM or DDR SDRAM graphics memory support
• 128 bit memory bus
• Dual-monitor configuration support, TV-Out, and DVI with companion chip SiS 301

Second, we have some rough specifications of the cards, based on SiS328, SiS332, SiS334 and SiS336 chips (which will be versions of SiS300 and will make the Xabre family):

Parameter / Chip	SiS328	SiS332	SiS334	SiS336
Chip Frequency, MHz	183	200	250	300
Memory Frequency, MHz	175(?)	200 (400 DDR)	250 (500 DDR)	275 (550 DDR)
AGP (Max.)	4x	8x	8x	8x
Memory Interface	?	128bit, DDR SDRAM	128bit, DDR SDRAM	128bit, DDR SDRAM

According to the specifications, these chips could be rather competitive not only with GeForce4 MX family and Radeon 7500 chip, but also with GeForce4 Ti4400 chips and Radeon 8500LE (at least, by the number of pipelines, texture modules and frequencies).

However, we should see Xabre family chips in work first, and then we’ll be able to make conclusions. Before that – these are just "bare specifications".