Small Heat-Sinks from OCZ Announced

by Anton Shilov
08/04/2003 | 04:47 AM

OCZ Technology announced special small heat-sinks for cooling MOSFETs, power regulators, memory on graphics cards and other small system components.

OCZ Flower Mini-Sinks feature textured fin technology and pure copper construction and ensure quality cooling of numerous hot and small components inside PCs. Measuring by 27x9x27mm, the OCZ Flower Mini-Sinks are rather compact for use with mainboards, but will obviously fill quite a lot of space when used to cool memory on graphics cards making it impossible to use the nearest to AGP PCI slot or slots in some cases.

As you may notice from the picture, the OCZ Flower Mini-Sinks are intended for TSOP memory chips, but obviously are also suitable for use with LQFP and BGA memory devices as well. The OCZ Flower Mini-Sinks will be shipping in packs of four and come with an easy to use, high quality pre-applied thermal tape from Sekisui Chemical.